Apparatus and method for high-speed transfer and centering of wafer substrates
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United States of America Patent
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Sep 12, 2000
Grant Date -
N/A
app pub date -
Nov 26, 1997
filing date -
Nov 26, 1997
priority date (Note) -
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Abstract
An apparatus for centering and gripping semiconductor wafers. A solenoid is used to actuate two or three curved contacts. Power to the solenoid, and position information from the solenoid is transmitted along a pair of wires. To center the wafer, the solenoid is actuated and the contacts move radially towards the center of the wafer. The contacts grip the edge of the wafer and a pulse-width-modulation signal is used to determine solenoid position as a function of back electromotive force value or waveform. During handling, the contacts hold the wafer such that the wafer does not move relative to the apparatus.
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