Method for forming conductive traces and printed circuits made thereby
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United States of America Patent
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Sep 12, 2000
Issued Date -
N/A
app pub date -
Jul 9, 1998
filing date -
May 1, 1996
priority date (Note) -
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status (Latency Note)
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Abstract
A method of forming circuit lines on a substrate by applying a roughened conductive metal layer using a copper foil carrier. The copper foil is etched away, leaving the roughened conductive metal embedded in the surface of the substrate. The conductive metal may be treated to remove an oxide layer. A photoresist may also be applied over the treated conductive metal layer to define a fine line circuit pattern. The photoresist defining the fine line circuit pattern is then removed to expose trenches in accordance with the desired circuit pattern. Copper is applied into the trenches over the exposed conductive metal, and the remaining photoresist, and conductive metal underlying the remaining photoresist, is removed to finish the fine line circuit pattern.
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