Importance

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Abstract

A structure for, and method of forming, an oxygen diffusion resistant electrode for high-dielectric-constant materials is disclosed. The electrode comprises a single grain of an oxygen stable material over a barrier layer. The single crystal oxygen stable layer is generally substantially impervious to oxygen diffusion at all relevant deposition and annealing temperatures. The disclosed structure is an integrated circuit comprising an array of microelectronic structures, with each of the microelectronic structures comprising an oxidizable layer (e.g., polysilicon 50), a barrier layer (e.g. TiN 64) overlying the oxidizable layer, a single crystal oxygen stable layer (e.g., Pt 98) overlying the barrier layer, and a high-dielectric-constant material layer (e.g., barium strontium titanate 36) overlying the oxygen stable layer. The disclosed method of fabricating an integrated circuit comprises forming an array of microelectronic structures, wherein forming each of said microelectronic structures comprises forming a barrier layer on an oxidizable layer, depositing a single crystal oxygen stable layer on the barrier layer, and depositing a high-dielectric-constant material layer on the oxygen stable layer. The single crystal oxygen stable layer prevents oxidation of the barrier layer and the oxidizable layer during subsequent processing.

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First Claim