Flexible lead structures and methods of making same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Sep 12, 2000
Issued Date -
N/A
app pub date -
Mar 12, 1999
filing date -
Jul 7, 1994
priority date (Note) -
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Abstract
A microelectronic component, such as a connector or a packaged semiconductor device is made by connecting multiple leads between a pair of elements and moving the elements away from one another so as to bend the leads toward a vertically extensive disposition. One of the elements includes a temporary support which is removed after the bending operation and after injecting and curing a dielectric material to form a dielectric layer surrounding and supporting the leads.
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