Lead frame and a semiconductor device
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Sep 12, 2000
Grant Date -
N/A
app pub date -
Nov 13, 1997
filing date -
Nov 14, 1996
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A semiconductor device of this invention includes a semiconductor chip on which a device is formed, inner leads reaching the periphery of the semiconductor chip, and bonding wires for electrically connecting the semiconductor chip and the inner leads. The semiconductor chip is fixed on a die pad portion, and a chip fixing inner lead is integrated with the die pad portion. To simplify the bonding wire connection process and improve the reliability, the chip fixing inner lead has a step portion so that the die pad portion is formed at a lower position than the inner leads. The step portion is formed so as to be offset from a line of the end portions of the inner leads in the opposite direction of the semiconductor chip, so an arbitrary bonding wire can be kept apart from the step portion. According to this invention, a semiconductor device which can properly prevent contact between the step portion and the bonding wire to improve the reliability, and a lead frame applicable to this semiconductor device can be provided.
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