Semiconductor device sealed with a sealing resin and including structure to balance sealing resin flow
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United States of America Patent
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Sep 12, 2000
Grant Date -
N/A
app pub date -
Jul 1, 1998
filing date -
Jul 18, 1997
priority date (Note) -
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status (Latency Note)
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Abstract
A method of manufacturing a semiconductor device including two semiconductor chips having mutually different element forming face areas on respective surfaces of a die pad of a lead frame prepared by sealing the semiconductor chips with resin by setting the lead frame in a resin sealing use mold having an injection gate for injecting therethrough a sealing resin, includes the steps of: (a) mounting the semiconductor chips on respective surfaces of the die pad in such a manner that when setting the lead frame in the resin sealing use mold, a distance between a side face of the semiconductor chip having a larger element forming face area on the injection gate side and a side face of the semiconductor chip having a smaller element forming face area on the injection gate side becomes shorter than a distance when these semiconductor chips are mounted at a center on respective surfaces of the die pad; (b) setting the lead frame in the resin sealing use mold so that the above side faces of the semiconductor chips are positioned on the injection gate side; and (c) injecting the sealing resin from the injection gate.
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