Method for sawing wafers employing multiple indexing techniques for multiple die dimensions
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United States of America Patent
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Sep 19, 2000
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app pub date -
Apr 29, 1998
filing date -
Nov 12, 1996
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Abstract
A semiconductor wafer saw and method of using the same for dicing semiconductor wafers comprising a wafer saw including variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their respective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices.
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