Polishing agent for semiconductor and method for its production

United States of America Patent

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Sep 19, 2000
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Apr 16, 1998
filing date
Apr 28, 1997

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Abstract

A polishing agent for semiconductor, comprising cerium oxide particles having a weight average particle size of from 0.1 to 0.35 .mu.m and a crystallite size of from 150 to 600 .ANG..

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SEIMI CHEMICAL CO., LTD.;SEIMI CHEMICAL CO.

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Inventor Name	Address	# of filed Patents	Total Citations
Aihara, Ryohei	Chigasaki, JP	1	34
Endoh, Kazuaki	Chigasaki, JP	13	135
Tsugita, Katsuyuki	Chigasaki, JP	10	68

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Polishing agent for semiconductor and method for its production

Number of patents in Portfolio can not be more than 2000

United States of America Patent

09061059

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