Importance

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Abstract

An apparatus for forming a film includes a substrate stage, a slit coater and a chamber lid. The substrate stage holds a substrate and defines a lower chamber of an openable low pressure chamber. A treatment solution feed applies the film onto the surface of the substrate held on the substrate stage when the chamber lid (3) is open. The chamber lid defines the low pressure chamber with the substrate stage (1). In the low pressure chamber, the film applied onto the surface of the substrate is subjected to drying by reducing the pressure in the chamber when the chamber lid is closed. Furthermore, according to a method for forming the film, immediately after the film has been applied onto the substrate, the thus applied film is subjected to low pressure drying at the position where the film has been applied.

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First Claim