Interconnect structure for joining a chip to a circuit card
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Sep 19, 2000
Grant Date -
N/A
app pub date -
Sep 3, 1999
filing date -
Apr 10, 1997
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A solder interconnection uses preferably lead-rich balls for making a low temperature chip attachment directly to any of the higher levels of packaging substrate. After a solder ball has been formed using standard processes, a ball limiting metal mask is formed using photoresist. A thin cap layer of preferably pure tin is deposited on a surface of the solder balls using a tin aqueous immersion process.
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