Abrasive articles comprising a fluorochemical agent for wafer surface modification
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United States of America Patent
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Sep 19, 2000
Grant Date -
N/A
app pub date -
Sep 19, 1997
filing date -
Sep 19, 1997
priority date (Note) -
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Abstract
This invention relates to fixed abrasive articles and abrasive constructions containing at least one fluorochemical agent. The fixed abrasive articles and abrasive constructions are used in semiconductor wafer surface modification processes during the fabrication of semiconductor devices. Specifically, fixed abrasive articles comprise an abrasive composite that is coextensive with a backing and at least one fluorochemical agent associated with the composite. The invention further relates to methods of making fixed abrasive articles comprising at least one fluorochemical agent.
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