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Abstract

A method of making a stacked microelectronic assembly such as a semiconductor chip assembly and its resulting structure includes providing a flexible substrate having a plurality of attachment sites and conductive terminals and including a wiring layer with leads extending to the attachment sites. The method includes assembling a plurality of microelectronic elements to the attachment sites and electrically interconnecting the microelectronic elements and the leads so that the electrically connected microelectronic elements are movable relative to the flexible substrate. The flexible substrate is then folded so as to stack at least some of the microelectronic elements in substantially vertical alignment with one another to provide a stacked assembly with the conductive terminals exposed at the bottom end of the stack. The stacked assembly is held in place using a thermally conductive adhesive and/or a mechanical element. The stacking structure and methods of the present invention provide an economical and space-saving assembly for use in electronic components. The flexibility of the electrical connection between each microelectronic element and the substrate provides for reliable electrical interconnections between the substrate and the microelectronic elements during thermal cycling.

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First Claim