Method and apparatus for establishing electrical contact between a wafer and a chuck
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United States of America Patent
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Sep 19, 2000
Grant Date -
N/A
app pub date -
Apr 22, 1997
filing date -
Apr 22, 1997
priority date (Note) -
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Abstract
A needle is pressed into the backside oxide of a semiconductor wafer and a voltage applied to the wafer greater than the breakdown voltage of the oxide in order to make an electrical contact with the bulk material of the wafer. A capacitor plate is provided proximate to a wafer on a chuck and a Kelvin probe is provided proximate to the wafer. A varying voltage is applied between the chuck and the capacitor plate and a voltage is monitored between the Kelvin probe and the chuck. The monitored voltage remaining constant indicates electrical contact between the chuck and the wafer.
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