Semiconductor device-mounted on a printed circuit board having solder bumps with excellent connection reliability
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United States of America Patent
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Sep 19, 2000
Grant Date -
N/A
app pub date -
Mar 27, 1998
filing date -
Mar 31, 1997
priority date (Note) -
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Abstract
In order to reduce a strain, developing in solder bumps in a BGA-type semiconductor device-mounting construction, so as to enhance a thermal fatigue life, voids, present in each solder bump joint portion of a BGA-type semiconductor device, are limited to a predetermined size, and a void of a large size, which would increase a strain to be produced, is eliminated.
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