Conduit system for a valve array
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United States of America Patent
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-
Sep 26, 2000
Grant Date -
N/A
app pub date -
Nov 27, 1996
filing date -
Nov 27, 1996
priority date (Note) -
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status (Latency Note)
Importance
Abstract
Construction of fluid conduit systems in printed circuit boards or other dielectric laminate substrates is disclosed. The fluid conduits can be angled or curved to provide greater directional control of fluid flow. Conduits are created by lamination of a first laminate layer and a second laminate layer. The first laminate layer is composed of a dielectric base material impregnated with a resin, with a first aperture defined therethrough, while the second laminate layer has a second aperture. The second aperture is positioned with respect to the first aperture to only partially overlap, together defining an angled conduit. Fluid flow through the conduits can be controlled using microdevice valves.
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