Scalable wide-array inkjet printhead and method for fabricating same
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United States of America Patent
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Sep 26, 2000
Grant Date -
N/A
app pub date -
Oct 28, 1997
filing date -
Oct 28, 1997
priority date (Note) -
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status (Latency Note)
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Abstract
A scalable wide-array printhead is formed by mounting multiple thermal inkjet printheads to a carrier substrate. The printheads are mounted to one face and logic ICs and drive ICs are mounted to an opposite face. Interconnects are formed through the carrier substrate to electrically couple the printheads to the logic ICs and drive ICs. The carrier substrate is formed of silicon and etched to define ink refill slots. A solder bump mounting process is used to mount the printheads to the carrier substrate. Such process serves to align each of the printheads. The solder forms a fluidic boundary around a printhead ink slot.
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