Adjusting the size of conductive lines based upon contact size
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United States of America Patent
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Sep 26, 2000
Grant Date -
N/A
app pub date -
Oct 1, 1999
filing date -
Oct 1, 1999
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The present invention is directed to a method of forming conductive interconnections in an integrated circuit device to optimize or at least maintain the speed at which signals propagate throughout the integrated circuit device. In one embodiment, the method comprises determining any variation in the size of a contact, as compared to its design size, and varying the size of a conductive line to be coupled to the contact based upon the variation in the size of the contact.
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