Micro sensor and method for making same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Sep 26, 2000
Grant Date -
N/A
app pub date -
Apr 17, 1997
filing date -
Apr 26, 1996
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The invention concerns a device comprising a first substrate and a second substrate intended to form a micro-system such as a sensor, at least one of the substrates being able to include electronic circuit components. The invention is characterised in that a layer of polymer is interposed between the first and the second substrate, in that the polymer layer includes at least one cavity which extends from the first to the second substrate and in that solder attaching means are provided in the cavity, said solder means assuring a traction resistant mechanical connection between the two substrates.
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