Apparatus and method for testing semiconductor devices formed on a semiconductor wafer
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United States of America Patent
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Sep 26, 2000
Grant Date -
N/A
app pub date -
Nov 25, 1998
filing date -
Nov 29, 1997
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The present specification and drawings disclose a testing apparatus designed for testing semiconductor elements formed on a semiconductor wafer. The testing apparatus comprises a main chuck having a surface on which a semiconductor wafer is placed, a contactor which is brought into contact with the semiconductor wafer, the contactor having probe terminals which are simultaneously brought into electric contact with a plurality of semiconductor elements formed on the semiconductor wafer, a reliability test mechanism for testing reliability of the semiconductor elements, an electric characteristic test mechanism for testing electric characteristics of the semiconductor element, and a switch mechanism for switching between the reliability test mechanism and the electric characteristic test mechanism such that the reliability test mechanism and the electric characteristic test mechanism are sequentially connected to the contactor when this contactor is in contact with the semiconductor wafer placed on the main chuck.
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