Via-less connection using interconnect traces between bond pads and a transducer coil of a magnetic head slider
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United States of America Patent
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-
Sep 26, 2000
Grant Date -
N/A
app pub date -
Jun 26, 1998
filing date -
Jun 26, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A planar air bearing slider assembly has an air bearing surface (ABS), a top surface opposite the ABS, and a trailing end. A thin film magnetic transducer is formed on the slider. The transducer has first and second spaced magnetic pole layers that define a magnetic yoke region. A coil structure having first and second ends is disposed between the pole layers for conducting data signals. First and second copper traces are routed from the first and second ends to the trailing end of the planar slider. First and second gold foil bonding pads located on the trailing end of the slider are attached to the copper traces with silver epoxy to provide an external connection to the coil.
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