Vacuum dispense apparatus for dispensing an encapsulant
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United States of America Patent
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-
Oct 3, 2000
Issued Date -
N/A
app pub date -
Jan 8, 1999
filing date -
Dec 29, 1994
priority date (Note) -
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status (Latency Note)
Importance
Abstract
A microelectronic assembly such as an assembly of a semiconductor chip and mounting substrate is encapsulated by applying an encapsulant to the assembly while maintaining the assembly under a subatmospheric pressure to minimize gas entrapment in the encapsulant. After the encapsulant flow around the assembly, a higher pressure is applied, causing collapse of any voids in the encapsulant. The encapsulant is then cured. The apparatus used for such encapsulation may include a chamber and a dispenser having a nozzle disposed within the chamber, and may also include a device for moving the nozzle or the assembly relative to the chamber.
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