Importance

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Abstract

A socket for use with a semiconductor chip assembly having conductive joining units such as solder balls thereon. The socket includes a flexible dielectric element such as a polyimide sheet having a plurality of apertures extending through it. A backing element disposed beneath the dielectric element has holes of slightly larger diameter than the apertures, the holes being aligned with the apertures so that a lip region of the flexible dielectric element overlies each hole. The socket also includes contacts disposed adjacent to the holes and apertures. The joining units on the chip assembly are of larger diameter than the apertures but smaller than the holes. When the chip assembly is engaged with the socket, the dielectric element deforms. The joining units pass through the apertures and are retained in engagement with the socket, and in electrical contact with the contacts of the socket, by the dielectric element.

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First Claim