Slurry recycling system of CMP apparatus and method of same
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United States of America Patent
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-
Oct 3, 2000
Grant Date -
N/A
app pub date -
Jan 21, 1999
filing date -
Mar 30, 1998
priority date (Note) -
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status (Latency Note)
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Abstract
A slurry recycling system of a CMP apparatus, and a method of the same, which restores the state of agglomeration of the abrasive grains to the initial state to enable reuse of the slurry and thereby reduces the cost of the polishing work and improves the operating rate of the CMP apparatus. Slurry S used in the CMP apparatus 1 is sent to a dispersion chamber 31. A vibration element 40 of an ultrasonic dispersion apparatus 4 mounted in the dispersion chamber 31 is made to vibrate by a vibrator 41 to generate ultrasonic vibration energy, whereby the agglomerated particles in the slurry S are made to disperse. Suitably thereafter, the slurry S is returned to the slurry feed apparatus 300 to enable reuse of the slurry S.
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