Thermoplastic resin composition and heat-resistant tray for IC
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United States of America Patent
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Oct 3, 2000
Grant Date -
N/A
app pub date -
May 11, 1999
filing date -
May 13, 1998
priority date (Note) -
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Abstract
A thermoplastic resin composition in which 5 to 45 parts by weight of carbon fiber and 0.1 to 10 parts by weight of conductive carbon black are compounded per 100 parts by weight of resin components comprising an aromatic polycarbonate resin and an aromatic polysulfone resin. The thermoplastic resin composition is excellent in heat-resistance and mechanical strength, and heat-resistant IC trays therefrom are useful products which can endure drying of IC at high temperature and are excellent in handling properties.
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