Method of testing a semiconductor device by automatically measuring probe tip parameters
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United States of America Patent
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Oct 3, 2000
Grant Date -
N/A
app pub date -
Apr 21, 1997
filing date -
Apr 21, 1997
priority date (Note) -
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Abstract
An integrated probe tip (20) parameter measuring device (70) is integrated onto the chuck (24) or substrate holder of a probe test station (10). Probe tip (20) force can be simultaneously measured for either a single probe tip, several probe, or all of the probe tips on a probe card (18). Integrating the measurement of probe tip (20) parameters such as probe tip force into a test station (10) yields real-time data about the probe process and allows feedback between measured probe tip parameters and probe chuck overdrive in the vertical direction. This integrated testing is done by periodically testing probe tip (20) parameters during the probing of die (26) on a wafer (22).
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