Modular thin film distributed filter
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Oct 3, 2000
Grant Date -
N/A
app pub date -
Feb 25, 1999
filing date -
Feb 25, 1999
priority date (Note) -
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Abstract
A modular thin film, distributed, lumped element band-pass filter. The filter circuitry is configured on a number of ceramic substrates. The component defining depositions are arranged to overlap and couple to one another with connecting vias. Alternative 800 MHz and 1.9 GHz band-pass filter circuits are disclosed. Bordering ground conductors and covering ground planes shield lumped impedance resonator and overlapping capacitor elements. The layers are configured to accommodate a range of frequencies and permit pre-fabrication with subsequent laser trimming, assembly and packaging.
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