Three dimensional mounting assembly for integrated circuits
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Oct 3, 2000
Grant Date -
N/A
app pub date -
May 22, 1998
filing date -
May 23, 1997
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A system and method for efficiently interconnecting a plurality of ICs, thereby improving the electrical performance of the overall system. In one embodiment of the system of the present invention, a plurality of carriers corresponds to a plurality of ICs, and a board has a plurality of board regions for receiving the plurality of ICs and are arranged so as to be attached to a backplane forming a vertical stack of boards.
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