Method for drying substrates
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United States of America Patent
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Oct 10, 2000
Issued Date -
N/A
app pub date -
Mar 10, 1999
filing date -
Apr 4, 1996
priority date (Note) -
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status (Latency Note)
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Abstract
In a method for drying substrates, in particular, semiconductor wafers, an especially residue-free drying of the substrates results when, during removal of the substrates from a liquid, a meniscus of the liquid forming at the transition between the substrate surface and the liquid surface is heated. A device for performing the method is disclosed.
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