Etching solution
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United States of America Patent
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Oct 10, 2000
Grant Date -
N/A
app pub date -
Aug 6, 1990
filing date -
Jul 5, 1990
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An electrolytically reclaimable etching solution for etching circuit boards and mold parts of copper and copper-based alloys, with a content of copper tetrammine sulfate, ammonia, ammonium sulfate, ammoniachloride, if necessary ammonium nitrate, and also a catalyzer for raising the etching rate. According to the invention, such an etching solution excels through a content of vanadium or a vanadium compound as a catalyzer in a concentration of 1 mg to 99 mg/l of etching solution, calculated as vanadium.
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