Radiation-curable resin composition

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United States of America Patent

PATENT NO 6130270
SERIAL NO

09225683

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Abstract

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A radiation curable composition comprising, (A) at least one compound containing a (meth)acrylate group represented by the following formula (1), ##STR1## wherein R.sup.1 is a hydrogen atom or a methyl group, R.sup.2 is an alkylene group or a hydroxyalkylene group having 2 to 6 carbon atoms, R.sup.3 is a divalent organic group, n is a number of 1 to 10, m is an integer of 0 or 1, and Ar.sup.1 and Ar.sup.2 are independently a group comprising an aromatic ring (B) at least one compound derived from trishydroxyethyl isocyanurate, and containing at least one (meth)acrylate group, and (C) at least one radiation polymerization initiator. The radiation curable resin composition affords a high productivity, exhibits high transparency, and produces molded articles exhibiting minimal coloration upon exposure to light, superior dimensional precision, high heat resistance, only slight adhesion to substrates under high temperature conditions. The composition is very useful for manufacturing molding articles.

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Patent Owner(s)

Patent OwnerAddress
JSR CORPORATIONTOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Takahashi, Toshihiko Brussels, BE 131 1967
Ukachi, Takashi Ibaraki, JP 71 1047
Ukon, Masakatsu Ibaraki, JP 8 76

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