Optical sensor package and method of making same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Oct 10, 2000
Grant Date -
N/A
app pub date -
Aug 21, 1998
filing date -
Aug 21, 1998
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A package that encapsulates an integrated circuit optical sensor and mounts on a support substrate includes a base substrate constructed of an insulating material. The optical sensor bottom surface is bonded to the base substrate top surface. Conductive strips on the base substrate top surface extend from a region near the optical sensor to an edge of the base substrate top surface. Wires are bonded on one end to a sensor bonding pad for which connection is desired and on the other end to a corresponding conductive strip. A window is bonded to the base substrate top surface in a spaced-apart relationship using seal material extending around the sensor enclosing each wire bond. Various means are provided for connecting each conductive strip to a corresponding trace on the support substrate. An electrochromic variable attenuator may be formed on the window, allowing control over the intensity of light striking the optical sensor.
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