Stackable ball grid array module and method
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Oct 10, 2000
Grant Date -
N/A
app pub date -
Feb 1, 1999
filing date -
Feb 1, 1999
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A stackable ball grid array module in which a chip select decoder is used to reduce the number of busses required for communication between modules. Additional modules may be added without requiring additional interconnect lines in the array. Cooling of the individual modules may be accomplished using a support member made from an enhanced heat transfer material or placing an enhanced heat transfer material layer between the modules. The devices on the module may be encapsulated, and the modules may be constructed in a chip first or cavity-down configuration. Methods are also disclosed.
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