Wet processing methods for the manufacture of electronic components using sequential chemical processing
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United States of America Patent
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Oct 17, 2000
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N/A
app pub date -
Jul 19, 1996
filing date -
Jul 19, 1996
priority date (Note) -
Expired
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Abstract
The present invention is directed to wet processing methods for the manufacture of electronic component precursors, such as semiconductor wafers used in integrated circuits. More specifically, this invention relates to methods, for example, prediffusion cleaning, stripping, and etching of electronic component precursors using sequential chemical processing techniques.
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