Apparatus and method for sputtering ionized material in a plasma
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United States of America Patent
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Oct 17, 2000
Grant Date -
N/A
app pub date -
Jul 30, 1998
filing date -
Jul 30, 1998
priority date (Note) -
Expired
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Abstract
An external inductive coil is used in a plasma process system having a dielectric shield which separates the coil from the plasma. The shield includes channels provided along the inner side of the shield facing the plasma region. The channels inhibit the formation of a continuous metal film over the inner surface of the shield during sputtering and deposition. The sidewalls defining the channels permit RF transmission after the surfaces directly facing the plasma are coated with metal.
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