Microelectronic connector with planar elastomer sockets
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United States of America Patent
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-
Oct 17, 2000
Grant Date -
N/A
app pub date -
Dec 11, 1997
filing date -
Dec 13, 1996
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A component for mounting semiconductor chips or other microelectronic units includes a compliant, sheet-like body with arrays of sheet-like conductive pads on upper and lower surfaces of the body. Flexible leads extending through the body interconnect conductive pads on the upper and lower surfaces. The leads are desirably formed from wire, such as gold wire, that is bonded to the conductive pads using a conductive epoxy or a eutectic bonding alloy. The component is made using sacrificial base sheets having conductive terminal portions to which the leads are initially bonded. The compliant body is formed by injecting a flowable material between the base sheets, curing the material and removing the base sheets by etching. The flowable material surrounds the leads such that the leads are supported by the cured compliant layer. The component may be used as an interposer or as a test socket.
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