Method for forming an integrated circuit
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United States of America Patent
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Oct 17, 2000
Grant Date -
N/A
app pub date -
Jan 30, 1998
filing date -
Jan 30, 1998
priority date (Note) -
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Abstract
In one embodiment, the reliability of an integrated circuit having a floating gate device (50), a high breakdown voltage transistor (52), and a low breakdown voltage transistor (54), which are electrically isolated from each other by a trench isolation region (12), is improved by using an oxidation resistant layer (24). The oxidation resistant layer (24) protects portions of the trench isolation region (12) when the gate dielectric layer (30) for the high breakdown voltage transistor (52) is formed, and when the gate dielectric layer (36) for the low breakdown voltage transistor (54) is formed. The oxidation resistant layer (24) minimizes etching of the field isolation region (12) so that thinning or recessing of the field isolation region (12) is minimized.
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