US Patent No: 6,133,627

Number of patents in Portfolio can not be more than 2000

Semiconductor chip package with center contacts

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Importance

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Abstract

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A semiconductor chip having contacts on the central region of its top surface is provided with a dielectric element overlying the central portion of the top surface. The dielectric element has a first surface facing toward the chip and a second surface facing away from the chip, a hole encompassing the central contacts and an edge bounding the hole. Central contact leads extend from the central contacts on the chip to central terminals on the dielectric element. The terminals on the dielectric element may be connected to a substrate using techniques commonly employed in surface mounting of electrical devices, such as solder bonding. The leads, and preferably the dielectric element, are flexible so that the terminals are moveable with respect to the contacts on the chip, to compensate for differential thermal expansion of the chip and substrate. The dielectric element may be provided with a compliant layer disposed between the terminals and the chip. The entire assembly is compact.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
TESSERA, INC.SAN JOSE, CA638

International Classification(s)

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  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
DiStefano, Thomas H Monte Sereno, CA 207 10148
Khandros, Igor Y Orinda, CA 297 14563

Cited Art Landscape

Patent Info (Count) # Cites Year
 
TESSERA, INC. (11)
5,055,907 Extended integration semiconductor structure with wiring layers 186 1989
5,148,266 Semiconductor chip assemblies having interposer and flexible lead 505 1990
5,148,265 Semiconductor chip assemblies with fan-in leads 529 1991
5,192,716 Method of making a extended integration semiconductor structure 81 1991
5,347,159 Semiconductor chip assemblies with face-up mounting and rear-surface connection to substrate 206 1991
5,282,312 Multi-layer circuit construction methods with customization features 139 1991
5,346,861 Semiconductor chip assemblies and methods of making same 170 1992
5,414,298 Semiconductor chip assemblies and components with pressure contact 89 1993
5,679,977 Semiconductor chip assemblies, methods of making same and components for same 233 1993
5,518,964 Microelectronic mounting with multiple lead deformation and bonding 347 1994
5,685,885 Wafer-scale techniques for fabrication of semiconductor chip assemblies 98 1994
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (10)
4,349,862 Capacitive chip carrier and multilayer ceramic capacitors 111 1980
4,648,179 Process of making interconnection structure for semiconductor device 53 1983
4,545,610 Method for forming elongated solder connections between a semiconductor device and a supporting substrate 272 1983
4,604,644 Solder interconnection structure for joining semiconductor devices to substrates that have improved fatigue life, and process for making 240 1985
4,811,082 High performance integrated circuit packaging structure 331 1986
4,766,670 Full panel electronic packaging structure and method of making same 73 1987
4,796,078 Peripheral/area wire bonding technique 141 1987
4,855,867 Full panel electronic packaging structure 55 1988
4,937,707 Flexible carrier for an electronic device 38 1988
5,117,275 Electronic substrate multiple location conductor attachment technology 20 1990
 
FREESCALE SEMICONDUCTOR, INC. (7)
5,006,673 Fabrication of pad array carriers from a universal interconnect structure 106 1989
4,989,069 Semiconductor package having leads that break-away from supports 61 1990
5,019,673 Flip-chip package for integrated circuits 93 1990
5,136,366 Overmolded semiconductor package with anchoring means 77 1990
5,216,278 Semiconductor device having a pad array carrier package 542 1992
5,222,014 Three-dimensional multi-chip pad array carrier 442 1992
5,241,133 Leadless pad array chip carrier 176 1992
 
TEXAS INSTRUMENTS INCORPORATED (6)
4,437,141 High terminal count integrated circuit device package 82 1981
4,709,468 Method for producing an integrated circuit product having a polyimide film interconnection structure 84 1986
4,695,870 Inverted chip carrier 97 1986
4,890,157 Integrated circuit product having a polyimide film interconnection structure 61 1987
5,123,850 Non-destructive burn-in test socket for integrated circuit die 240 1991
5,550,401 Lead on chip semiconductor device having bus bars and crossing leads 9 1994
 
HITACHI, LTD. (4)
4,764,804 Semiconductor device and process for producing the same 108 1987
4,893,172 Connecting structure for electronic part and method of manufacturing the same 218 1988
5,086,337 Connecting structure of electronic part and electronic device using the structure 133 1988
5,045,922 Installation structure of integrated circuit devices 31 1990
 
LOCKHEED MARTIN CORPORATION (4)
4,783,695 Multichip integrated circuit packaging configuration and method 339 1986
4,884,122 Method and configuration for testing electronic circuits and integrated circuit chips using a removable overlay layer 92 1988
4,918,811 Multichip integrated circuit packaging method 148 1989
4,937,203 Method and configuration for testing electronic circuits and integrated circuit chips using a removable overlay layer 72 1989
 
RAYTHEON COMPANY (4)
4,536,469 Semiconductor structures and manufacturing methods 26 1981
4,658,332 Compliant layer printed circuit board 50 1985
4,783,719 Test connector for electrical devices 105 1987
4,847,146 Process for fabricating compliant layer board with selectively isolated solder pads 57 1988
 
STOVOKOR TECHNOLOGY LLC (4)
4,860,088 Electrical interconnect tape 29 1987
4,926,241 Flip substrate for chip mount 146 1988
5,289,346 Peripheral to area adapter with protective bumper for an integrated circuit chip 113 1993
5,379,191 Compact adapter package providing peripheral to area translation for an integrated circuit chip 104 1994
 
INTEL CORPORATION (3)
4,574,470 Semiconductor chip mounting system 32 1984
4,667,220 Semiconductor chip module interconnection system 42 1984
5,210,939 Lead grid array integrated circuit 92 1992
 
LSI LOGIC CORPORATION (3)
5,504,035 Process for solder ball interconnecting a semiconductor device to a substrate using a noble metal foil embedded interposer substrate 90 1993
5,552,631 Semiconductor device assembly including power or ground plane which is provided on opposite surface of insulating layer from signal traces, and is exposed to central opening in insulating layer for interconnection to semiconductor die 47 1993
5,763,952 Multi-layer tape having distinct signal, power and ground planes, semiconductor device assembly employing same, apparatus for and method of assembling same 22 1996
 
MITSUBISHI DENKI KABUSHIKI KAISHA (3)
4,941,033 Semiconductor integrated circuit device 78 1989
4,942,140 Method of packaging semiconductor device 80 1989
4,967,261 Tape carrier for assembling an IC chip on a substrate 62 1989
 
MOTOROLA, INC. (3)
4,700,473 Method of making an ultra high density pad array chip carrier 99 1986
5,045,921 Pad array carrier IC device using flexible tape 194 1989
5,029,325 TAB tape translator for use with semiconductor devices 36 1990
 
Bell Telephone Laboratories, Incorporated (2)
4,670,770 Integrated circuit chip-and-substrate assembly 147 1984
4,937,653 Semiconductor integrated circuit chip-to-chip interconnection scheme 247 1988
 
MICRON TECHNOLOGY, INC. (2)
4,189,825 Integrated test and assembly device 68 1977
5,027,191 Cavity-down chip carrier with pad grid array 55 1989
 
NATIONAL SEMICONDUCTOR CORPORATION (2)
4,649,415 Semiconductor package with tape mounted die 65 1985
4,751,199 Process of forming a compliant lead frame for array-type semiconductor packages 119 1987
 
NEC CORPORATION (2)
4,874,721 Method of manufacturing a multichip package with increased adhesive strength 61 1988
5,350,947 Film carrier semiconductor device 60 1992
 
SGS-THOMSON MICROELECTRONICS, INC. (2)
4,627,151 Automatic assembly of integrated circuits 57 1984
4,685,998 Process of forming integrated circuits with contact pads in a standard array 157 1986
 
ADVANCED MICRO DEVICES, INC. (1)
4,887,148 Pin grid array package structure 38 1988
 
ADVANCED SEMICONDUCTOR PACKAGES LTD, C/O HYCOMP LTD. (1)
4,866,841 Integrated circuit chip carrier 29 1988
 
AMP Incorporated (1)
4,410,905 Power, ground and decoupling structure for chip carriers 77 1981
 
AT&T CORP. (1)
RE35119 Textured metallic compression bonding 66 1992
 
AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD. (1)
4,842,662 Process for bonding integrated circuit components 62 1988
 
CIRCUIT COMPONENTS, INCORPORATED (1)
4,793,814 Electrical circuit board interconnect 267 1986
 
CITIZEN WATCH CO., LTD. (1)
4,237,607 Method of assembling semiconductor integrated circuit 52 1978
 
Contraves AG (1)
4,975,765 Highly integrated circuit and method for the production thereof 74 1989
 
FUJITSU LIMITED (1)
4,751,482 Semiconductor integrated circuit device having a multi-layered wiring board for ultra high speed connection 70 1986
 
GAO Gesellschaft fur Automation und Organisation mbH (1)
5,055,913 Terminal arrangement for integrated circuit device 43 1989
 
GAO GESELLSCHAFT FUR AUTOMATION UND ORGANISATION MBH, EUCKENSTRASSE 12, 8000 MUNCHEN 70, FEDERAL REPUBLIC OF GERMANY (1)
4,897,534 Data carrier having an integrated circuit and a method for producing the same 52 1987
 
GENERAL ELECTRIC COMPANY (1)
4,855,872 Leadless ceramic chip carrier printed wiring board adapter 24 1987
 
HEWLETT-PACKARD COMPANY (1)
5,053,922 Demountable tape-automated bonding system 46 1989
 
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. (1)
4,954,878 Method of packaging and powering integrated circuit chips and the chip assembly formed thereby 139 1989
 
HITACHI MAXELL, LTD. (1)
4,961,105 Arrangement of a semiconductor device for use in a card 52 1989
 
Hughes Aircraft Company (1)
4,924,353 Connector system for coupling to an integrated circuit chip 112 1988
 
KABUSHIKI KAISHA TOSHIBA (1)
4,878,098 Semiconductor integrated circuit device 46 1989
 
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (1)
4,356,374 Electronics circuit device and method of making the same 50 1980
 
MAXIM INTEGRATED PRODUCTS, INC. (1)
4,628,406 Method of packaging integrated circuit chips, and integrated circuit package 70 1985
 
MICROELECTRONIC PACKAGING AMERICA, A CORPORATION OF CA (1)
5,227,583 Ceramic package and method for making same 24 1991
 
NORTEL NETWORKS CORPORATION (1)
4,814,295 Mounting of semiconductor chips on a plastic substrate 86 1986
 
NORTEL NETWORKS LIMITED (1)
4,710,798 Integrated circuit chip package 125 1985
 
Olin Corporation (1)
4,721,993 Interconnect tape for use in tape automated bonding 44 1986
 
Polycon Corporation (1)
5,023,205 Method of fabricating hybrid circuit structures 37 1989
 
Roger A. Johnston Eaton Corporation (1)
4,655,524 Solderless connection apparatus 56 1985
 
SANDIA CORPORATION (1)
4,681,654 Flexible film semiconductor chip carrier 87 1986
 
SHARP KABUSHIKI KAISHA (1)
4,818,728 Method of making a hybrid semiconductor device 283 1987
 
SILICON VALLEY BANK (1)
5,477,082 Bi-planar multi-chip module 220 1994
 
SUN MICROSYSTEMS, INC. (1)
5,394,009 Tab semiconductor package with cushioned land grid array outer lead bumps 100 1993
 
TEKTRONIX, INC. (1)
4,597,617 Pressure interconnect package for integrated circuits 114 1984
 
TERADATA US, INC. (1)
5,454,160 Apparatus and method for stacking integrated circuit devices 128 1993
 
Thomson-CSF (1)
4,993,954 Device for interconnection between and integrated circuit and an electrical circuit 19 1989
 
TRW INC. (1)
5,217,916 Method of making an adaptive configurable gate array 86 1991
 
UTMC MICROELECTRONIC SYSTEMS INC. (1)
4,772,936 Pretestable double-sided tab design 76 1987
 
WHITAKER CORPORATION, THE (1)
5,637,919 Perimeter independent precision locating member 37 1995

Patent Citation Ranking

Forward Cite Landscape

Patent Info (Count) # Cites Year
 
QUALCOMM INCORPORATED (12)
8,021,976 Method of wire bonding over active area of a semiconductor circuit 3 2003
8,026,588 Method of wire bonding over active area of a semiconductor circuit 2 2007
8,742,580 Method of wire bonding over active area of a semiconductor circuit 0 2007
7,960,272 Method for fabricating thermal compliant semiconductor chip wiring structure for chip scale packaging 2 2007
8,138,079 Method of wire bonding over active area of a semiconductor circuit 1 2007
8,748,227 Method of fabricating chip package 0 2008
8,148,806 Multiple chips bonded to packaging structure with low noise and multiple selectable functions 6 2008
8,044,475 Chip package 3 2009
8,426,982 Structure and manufacturing method of chip scale package 0 2009
8,168,527 Semiconductor chip and method for fabricating the same 0 2009
8,334,588 Circuit component with conductive layer structure 1 2011
8,368,193 Chip package 1 2011
 
ROUND ROCK RESEARCH, LLC (8)
7,122,908 Electronic device package 2 2001
7,329,945 Flip-chip adaptor package for bare die 18 2005
RE43112 Stackable ball grid array package 0 2006
7,381,591 Flip-chip adaptor package for bare die 18 2006
8,198,138 Methods for providing and using grid array packages 0 2007
8,299,598 Grid array packages and assemblies including the same 12 2010
8,164,175 Stackable semiconductor device assemblies 0 2010
8,049,317 Grid array packages 0 2010
 
BOSTON SCIENTIFIC SCIMED, INC. (3)
7,179,286 Stent with stepped connectors 8 2003
7,988,720 Longitudinally flexible expandable stent 3 2007
8,449,597 Longitudinally flexible expandable stent 0 2011
 
HYUNDAI ELECTRONICS INDUSTRIES CO., LTD. (2)
6,589,813 Chip size stack package and method of fabricating the same 7 2000
6,828,686 Chip size stack package and method of fabricating the same 7 2003
 
RENESAS TECHNOLOGY CORP. (2)
RE41721 Semiconductor device having an improved connected arrangement between a semiconductor pellet and base substrate electrodes 23 2000
RE41722 Semiconductor device having an improved connection arrangement between a semiconductor pellet and base substrate electrodes and a method of manufacture thereof 24 2002
 
SHINKO ELECTRIC INDUSTRIES CO., LTD. (2)
7,719,123 Method of manufacturing semiconductor device 0 2008
8,148,254 Method of manufacturing semiconductor device 1 2010
 
TESSERA, INC. (2)
7,098,078 Microelectronic component and assembly having leads with offset portions 12 2002
7,271,481 Microelectronic component and assembly having leads with offset portions 13 2006
 
TEXAS INSTRUMENTS INCORPORATED (2)
6,768,646 High density internal ball grid array integrated circuit package 1 1998
6,800,944 Power/ground ring substrate for integrated circuits 9 2001
 
UNITED TEST AND ASSEMBLY CENTER LTD. (2)
7,443,041 Packaging of a microchip device 1 2002
7,504,715 Packaging of a microchip device 0 2006
 
BOSTON SCIENTIFIC LIMITED (1)
8,728,147 Longitudinally flexible expandable stent 0 2011
 
Clear Logic, Inc. (1)
6,348,742 Sacrificial bond pads for laser configured integrated circuits 12 1999
 
DELPHI TECHNOLOGIES, INC. (1)
6,472,251 Method for integrated circuit packaging 3 2001
 
MEDTRONIC, INC. (1)
8,489,196 System, apparatus and method for interacting with a targeted tissue of a patient 0 2003
 
MICRON TECHNOLOGY, INC. (1)
7,279,364 Flip-chip adaptor package for bare die 0 2006
 
SAMSUNG ELECTRONICS CO., LTD. (1)
8,588,017 Memory circuits, systems, and modules for performing DRAM refresh operations and methods of operating the same 0 2011
 
TYCO ELECTRONICS JAPAN G.K. (1)
6,830,461 Electrical contact and electrical connection device using same 6 2002