Semiconductor chip package with center contacts

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 6133627
SERIAL NO

08984615

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A semiconductor chip having contacts on the central region of its top surface is provided with a dielectric element overlying the central portion of the top surface. The dielectric element has a first surface facing toward the chip and a second surface facing away from the chip, a hole encompassing the central contacts and an edge bounding the hole. Central contact leads extend from the central contacts on the chip to central terminals on the dielectric element. The terminals on the dielectric element may be connected to a substrate using techniques commonly employed in surface mounting of electrical devices, such as solder bonding. The leads, and preferably the dielectric element, are flexible so that the terminals are moveable with respect to the contacts on the chip, to compensate for differential thermal expansion of the chip and substrate. The dielectric element may be provided with a compliant layer disposed between the terminals and the chip. The entire assembly is compact.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
TESSERA, INC.SAN JOSE, CA682

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Distefano, Thomas H Monte Sereno, CA 191 12488
Khandros, Igor Y Orinda, CA 220 16445

Cited Art Landscape

Patent Info (Count) # Cites Year
 
HITACHI MAXELL, LTD. (1)
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ADVANCED SEMICONDUCTOR PACKAGES LTD, C/O HYCOMP LTD. (1)
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Roger Corporation (1)
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HITACHI, LTD. (4)
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* 4893172 Connecting structure for electronic part and method of manufacturing the same 219 1988
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WHITAKER CORPORATION, THE (1)
5637919 Perimeter independent precision locating member 38 1995
 
Sandia Corporation (1)
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Contraves AG (1)
* 4975765 Highly integrated circuit and method for the production thereof 74 1989
 
KABUSHIKI KAISHA TOSHIBA (1)
* 4878098 Semiconductor integrated circuit device 46 1989
 
LOCKHEED MARTIN CORPORATION (4)
* 4783695 Multichip integrated circuit packaging configuration and method 364 1986
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* 4918811 Multichip integrated circuit packaging method 164 1989
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BELL TELEPHONE LABORATORIES, INCORPORATED (2)
* 4670770 Integrated circuit chip-and-substrate assembly 151 1984
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RAYTHEON COMPANY (4)
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INTERNATIONAL BUSINESS MACHINES CORPORATION (10)
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5117275 Electronic substrate multiple location conductor attachment technology 20 1990
 
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HEWLETT-PACKARD COMPANY (1)
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GAO Gesellschaft fur Automation und Organisation mbH (1)
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HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. (1)
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LSI LOGIC CORPORATION (3)
5504035 Process for solder ball interconnecting a semiconductor device to a substrate using a noble metal foil embedded interposer substrate 92 1993
5552631 Semiconductor device assembly including power or ground plane which is provided on opposite surface of insulating layer from signal traces, and is exposed to central opening in insulating layer for interconnection to semiconductor die 55 1993
5763952 Multi-layer tape having distinct signal, power and ground planes, semiconductor device assembly employing same, apparatus for and method of assembling same 22 1996
 
TERADATA US, INC. (1)
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FUJITSU LIMITED (1)
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Hughes Aircraft Company (1)
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5394009 Tab semiconductor package with cushioned land grid array outer lead bumps 100 1993
 
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NATIONAL SEMICONDUCTOR CORPORATION (2)
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INTEL CORPORATION (3)
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5210939 Lead grid array integrated circuit 92 1992
 
NORTEL NETWORKS CORPORATION (1)
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TEXAS INSTRUMENTS INCORPORATED (6)
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* 4709468 Method for producing an integrated circuit product having a polyimide film interconnection structure 85 1986
* 4695870 Inverted chip carrier 144 1986
* 4890157 Integrated circuit product having a polyimide film interconnection structure 68 1987
5123850 Non-destructive burn-in test socket for integrated circuit die 241 1991
5550401 Lead on chip semiconductor device having bus bars and crossing leads 9 1994
 
MITSUBISHI DENKI KABUSHIKI KAISHA (3)
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TEKTRONIX, INC. (1)
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FREESCALE SEMICONDUCTOR, INC. (7)
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* 5019673 Flip-chip package for integrated circuits 95 1990
5136366 Overmolded semiconductor package with anchoring means 81 1990
5216278 Semiconductor device having a pad array carrier package 595 1992
5222014 Three-dimensional multi-chip pad array carrier 517 1992
5241133 Leadless pad array chip carrier 203 1992
 
MICRON TECHNOLOGY, INC. (1)
* 5027191 Cavity-down chip carrier with pad grid array 55 1989
 
THOMSON-CSF (1)
* 4993954 Device for interconnection between and integrated circuit and an electrical circuit 19 1989
 
SILICON VALLEY BANK (1)
5477082 Bi-planar multi-chip module 230 1994
 
Polycon Corporation (1)
* 5023205 Method of fabricating hybrid circuit structures 37 1989
 
UTMC MICROELECTRONIC SYSTEMS INC. (1)
* 4772936 Pretestable double-sided tab design 76 1987
 
TRW INC. (1)
5217916 Method of making an adaptive configurable gate array 120 1991
 
NEC CORPORATION (2)
* 4874721 Method of manufacturing a multichip package with increased adhesive strength 61 1988
5350947 Film carrier semiconductor device 60 1992
 
STOVOKOR TECHNOLOGY LLC (4)
* 4860088 Electrical interconnect tape 29 1987
* 4926241 Flip substrate for chip mount 147 1988
5289346 Peripheral to area adapter with protective bumper for an integrated circuit chip 114 1993
5379191 Compact adapter package providing peripheral to area translation for an integrated circuit chip 118 1994
 
AMP Incorporated (1)
* 4410905 Power, ground and decoupling structure for chip carriers 77 1981
 
RCA Corporation (1)
* 4855872 Leadless ceramic chip carrier printed wiring board adapter 24 1987
 
TESSERA, INC. (11)
* 5055907 Extended integration semiconductor structure with wiring layers 188 1989
5148266 Semiconductor chip assemblies having interposer and flexible lead 619 1990
5148265 Semiconductor chip assemblies with fan-in leads 648 1991
5192716 Method of making a extended integration semiconductor structure 83 1991
5347159 Semiconductor chip assemblies with face-up mounting and rear-surface connection to substrate 247 1991
5282312 Multi-layer circuit construction methods with customization features 154 1991
5346861 Semiconductor chip assemblies and methods of making same 177 1992
5414298 Semiconductor chip assemblies and components with pressure contact 91 1993
5679977 Semiconductor chip assemblies, methods of making same and components for same 345 1993
5518964 Microelectronic mounting with multiple lead deformation and bonding 408 1994
5685885 Wafer-scale techniques for fabrication of semiconductor chip assemblies 108 1994
 
AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD. (1)
* 4842662 Process for bonding integrated circuit components 62 1988
 
MICROELECTRONIC PACKAGING AMERICA, A CORPORATION OF CA (1)
5227583 Ceramic package and method for making same 25 1991
 
SHARP KABUSHIKI KAISHA (1)
* 4818728 Method of making a hybrid semiconductor device 303 1987
 
SGS-THOMSON MICROELECTRONICS, INC. (2)
* 4627151 Automatic assembly of integrated circuits 58 1984
* 4685998 Process of forming integrated circuits with contact pads in a standard array 163 1986
 
OLIN CORPORATION (1)
* 4721993 Interconnect tape for use in tape automated bonding 44 1986
 
CIRCUIT COMPONENTS, INCORPORATED (1)
* 4793814 Electrical circuit board interconnect 310 1986
 
GAO GESELLSCHAFT FUR AUTOMATION UND ORGANISATION MBH, EUCKENSTRASSE 12, 8000 MUNCHEN 70, FEDERAL REPUBLIC OF GERMANY (1)
* 4897534 Data carrier having an integrated circuit and a method for producing the same 60 1987
 
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (1)
* 4356374 Electronics circuit device and method of making the same 50 1980
 
AT&T CORP. (1)
RE35119 Textured metallic compression bonding 72 1992
* Cited By Examiner

Patent Citation Ranking

Forward Cite Landscape

Patent Info (Count) # Cites Year
 
QUALCOMM INCORPORATED (18)
8021976 Method of wire bonding over active area of a semiconductor circuit 4 2003
8026588 Method of wire bonding over active area of a semiconductor circuit 5 2007
9153555 Method of wire bonding over active area of a semiconductor circuit 0 2007
8742580 Method of wire bonding over active area of a semiconductor circuit 0 2007
7960272 Method for fabricating thermal compliant semiconductor chip wiring structure for chip scale packaging 2 2007
9142527 Method of wire bonding over active area of a semiconductor circuit 1 2007
8138079 Method of wire bonding over active area of a semiconductor circuit 4 2007
* 2008/0315,424 Structure and manufactruing method of chip scale package 5 2008
9018774 Chip package 2 2008
8748227 Method of fabricating chip package 0 2008
8148806 Multiple chips bonded to packaging structure with low noise and multiple selectable functions 13 2008
8044475 Chip package 4 2009
* 2009/0121,302 Chip Package 4 2009
8426982 Structure and manufacturing method of chip scale package 1 2009
8168527 Semiconductor chip and method for fabricating the same 2 2009
8334588 Circuit component with conductive layer structure 2 2011
8368193 Chip package 1 2011
8912666 Structure and manufacturing method of chip scale package 0 2013
 
MICRON TECHNOLOGY, INC. (2)
7279364 Flip-chip adaptor package for bare die 0 2006
* 2006/0220,243 ELECTRONIC DEVICE PACKAGE 1 2006
 
Clear Logic, Inc. (1)
* 6348742 Sacrificial bond pads for laser configured integrated circuits 16 1999
 
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (1)
* 2015/0357,317 Methods of Packaging Semiconductor Devices and Packaged Semiconductor Devices 0 2014
 
SAMSUNG ELECTRONICS CO., LTD. (1)
8588017 Memory circuits, systems, and modules for performing DRAM refresh operations and methods of operating the same 8 2011
 
UNITED TEST AND ASSEMBLY CENTER LTD. (2)
7504715 Packaging of a microchip device 0 2006
* 2007/0013,040 PACKAGING OF A MICROCHIP DEVICE 1 2006
 
JDS UNIPHASE CORPORATION (1)
* 2003/0177,949 Methods for producing enhanced interference pigments 3 2003
 
SHINKO ELECTRIC INDUSTRIES CO., LTD. (3)
* 7719123 Method of manufacturing semiconductor device 0 2008
* 2009/0045,529 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE 2 2008
8148254 Method of manufacturing semiconductor device 1 2010
 
MEDTRONIC, INC. (2)
8489196 System, apparatus and method for interacting with a targeted tissue of a patient 1 2003
* 2005/0075,683 System, apparatus and method for interacting with a targeted tissue of a patient 14 2003
 
UTAC HEADQUARTERS PTE. LTD. (1)
7443041 Packaging of a microchip device 1 2002
 
ROUND ROCK RESEARCH, LLC (9)
7122908 Electronic device package 8 2001
* 2002/0100,989 Electronic device package 8 2001
7329945 Flip-chip adaptor package for bare die 39 2005
RE43112 Stackable ball grid array package 1 2006
7381591 Flip-chip adaptor package for bare die 43 2006
8198138 Methods for providing and using grid array packages 0 2007
8299598 Grid array packages and assemblies including the same 29 2010
8164175 Stackable semiconductor device assemblies 0 2010
8049317 Grid array packages 0 2010
 
RENESAS TECHNOLOGY CORP. (2)
RE41721 Semiconductor device having an improved connected arrangement between a semiconductor pellet and base substrate electrodes 47 2000
RE41722 Semiconductor device having an improved connection arrangement between a semiconductor pellet and base substrate electrodes and a method of manufacture thereof 49 2002
 
DELPHI TECHNOLOGIES, INC. (1)
* 6472251 Method for integrated circuit packaging 3 2001
 
CONTINENTAL AUTOMOTIVE GMBH (2)
* 9258918 Module for integrated control electronics having simplified design 0 2008
* 2010/0271,791 Module for Integrated Control Electronics Having Simplified Design 1 2008
 
MICRO-ASI, INC. (1)
* 2002/0076,854 System, method and apparatus for constructing a semiconductor wafer-interposer using B-Stage laminates 3 2000
 
TEXAS INSTRUMENTS INCORPORATED (3)
6768646 High density internal ball grid array integrated circuit package 1 1998
6800944 Power/ground ring substrate for integrated circuits 11 2001
* 2003/0111,738 Power/ground ring substrate for integrated circuits 0 2001
 
BOSTON SCIENTIFIC SCIMED, INC. (3)
7179286 Stent with stepped connectors 15 2003
7988720 Longitudinally flexible expandable stent 3 2007
8449597 Longitudinally flexible expandable stent 1 2011
 
TESSERA, INC. (2)
7098078 Microelectronic component and assembly having leads with offset portions 17 2002
7271481 Microelectronic component and assembly having leads with offset portions 17 2006
 
TYCO ELECTRONICS JAPAN G.K. (1)
6830461 Electrical contact and electrical connection device using same 9 2002
 
BOSTON SCIENTIFIC LIMITED (1)
8728147 Longitudinally flexible expandable stent 0 2011
 
HYUNDAI ELECTRONICS INDUSTRIES CO., LTD. (2)
* 6589813 Chip size stack package and method of fabricating the same 9 2000
6828686 Chip size stack package and method of fabricating the same 11 2003
* Cited By Examiner