US Patent No: 6,133,627
Number of patents in Portfolio can not be more than 2000
Semiconductor chip package with center contacts
Stats
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Oct 17, 2000
Issued date -
Dec 3, 1997
filing date -
08/984,615
serial no -
Expired
status
Importance
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Abstract
A semiconductor chip having contacts on the central region of its top surface is provided with a dielectric element overlying the central portion of the top surface. The dielectric element has a first surface facing toward the chip and a second surface facing away from the chip, a hole encompassing the central contacts and an edge bounding the hole. Central contact leads extend from the central contacts on the chip to central terminals on the dielectric element. The terminals on the dielectric element may be connected to a substrate using techniques commonly employed in surface mounting of electrical devices, such as solder bonding. The leads, and preferably the dielectric element, are flexible so that the terminals are moveable with respect to the contacts on the chip, to compensate for differential thermal expansion of the chip and substrate. The dielectric element may be provided with a compliant layer disposed between the terminals and the chip. The entire assembly is compact.
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First Claim
Related Publications
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International Classification(s)
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Cited Art
| Patent Info | (Count) | # Cites | Year |
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| 5,055,907 Extended integration semiconductor structure with wiring layers | 170 | 1989 | |
| 5,148,266 Semiconductor chip assemblies having interposer and flexible lead | 460 | 1990 | |
| 5,148,265 Semiconductor chip assemblies with fan-in leads | 488 | 1991 | |
| 5,192,716 Method of making a extended integration semiconductor structure | 75 | 1991 | |
| 5,347,159 Semiconductor chip assemblies with face-up mounting and rear-surface connection to substrate | 194 | 1991 | |
| 5,282,312 Multi-layer circuit construction methods with customization features | 136 | 1991 | |
| 5,346,861 Semiconductor chip assemblies and methods of making same | 166 | 1992 | |
| 5,414,298 Semiconductor chip assemblies and components with pressure contact | 86 | 1993 | |
| 5,679,977 Semiconductor chip assemblies, methods of making same and components for same | 194 | 1993 | |
| 5,518,964 Microelectronic mounting with multiple lead deformation and bonding | 324 | 1994 | |
| 5,685,885 Wafer-scale techniques for fabrication of semiconductor chip assemblies | 95 | 1994 | |
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| 4,349,862 Capacitive chip carrier and multilayer ceramic capacitors | 104 | 1980 | |
| 4,648,179 Process of making interconnection structure for semiconductor device | 53 | 1983 | |
| 4,545,610 Method for forming elongated solder connections between a semiconductor device and a supporting substrate | 271 | 1983 | |
| 4,604,644 Solder interconnection structure for joining semiconductor devices to substrates that have improved fatigue life, and process for making | 229 | 1985 | |
| 4,811,082 High performance integrated circuit packaging structure | 259 | 1986 | |
| 4,766,670 Full panel electronic packaging structure and method of making same | 60 | 1987 | |
| 4,796,078 Peripheral/area wire bonding technique | 141 | 1987 | |
| 4,855,867 Full panel electronic packaging structure | 50 | 1988 | |
| 4,937,707 Flexible carrier for an electronic device | 37 | 1988 | |
| 5,117,275 Electronic substrate multiple location conductor attachment technology | 20 | 1990 | |
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| 5,006,673 Fabrication of pad array carriers from a universal interconnect structure | 106 | 1989 | |
| 4,989,069 Semiconductor package having leads that break-away from supports | 60 | 1990 | |
| 5,019,673 Flip-chip package for integrated circuits | 93 | 1990 | |
| 5,136,366 Overmolded semiconductor package with anchoring means | 73 | 1990 | |
| 5,216,278 Semiconductor device having a pad array carrier package | 519 | 1992 | |
| 5,222,014 Three-dimensional multi-chip pad array carrier | 390 | 1992 | |
| 5,241,133 Leadless pad array chip carrier | 173 | 1992 | |
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| 4,437,141 High terminal count integrated circuit device package | 77 | 1981 | |
| 4,709,468 Method for producing an integrated circuit product having a polyimide film interconnection structure | 83 | 1986 | |
| 4,695,870 Inverted chip carrier | 84 | 1986 | |
| 4,890,157 Integrated circuit product having a polyimide film interconnection structure | 55 | 1987 | |
| 5,123,850 Non-destructive burn-in test socket for integrated circuit die | 239 | 1991 | |
| 5,550,401 Lead on chip semiconductor device having bus bars and crossing leads | 9 | 1994 | |
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| 4,764,804 Semiconductor device and process for producing the same | 105 | 1987 | |
| 4,893,172 Connecting structure for electronic part and method of manufacturing the same | 214 | 1988 | |
| 5,086,337 Connecting structure of electronic part and electronic device using the structure | 132 | 1988 | |
| 5,045,922 Installation structure of integrated circuit devices | 30 | 1990 | |
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| 4,783,695 Multichip integrated circuit packaging configuration and method | 322 | 1986 | |
| 4,884,122 Method and configuration for testing electronic circuits and integrated circuit chips using a removable overlay layer | 92 | 1988 | |
| 4,918,811 Multichip integrated circuit packaging method | 139 | 1989 | |
| 4,937,203 Method and configuration for testing electronic circuits and integrated circuit chips using a removable overlay layer | 70 | 1989 | |
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| 4,536,469 Semiconductor structures and manufacturing methods | 26 | 1981 | |
| 4,658,332 Compliant layer printed circuit board | 48 | 1985 | |
| 4,783,719 Test connector for electrical devices | 104 | 1987 | |
| 4,847,146 Process for fabricating compliant layer board with selectively isolated solder pads | 57 | 1988 | |
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| 4,860,088 Electrical interconnect tape | 29 | 1987 | |
| 4,926,241 Flip substrate for chip mount | 146 | 1988 | |
| 5,289,346 Peripheral to area adapter with protective bumper for an integrated circuit chip | 113 | 1993 | |
| 5,379,191 Compact adapter package providing peripheral to area translation for an integrated circuit chip | 88 | 1994 | |
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| 4,574,470 Semiconductor chip mounting system | 32 | 1984 | |
| 4,667,220 Semiconductor chip module interconnection system | 42 | 1984 | |
| 5,210,939 Lead grid array integrated circuit | 91 | 1992 | |
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| 5,504,035 Process for solder ball interconnecting a semiconductor device to a substrate using a noble metal foil embedded interposer substrate | 88 | 1993 | |
| 5,552,631 Semiconductor device assembly including power or ground plane which is provided on opposite surface of insulating layer from signal traces, and is exposed to central opening in insulating layer for interconnection to semiconductor die | 44 | 1993 | |
| 5,763,952 Multi-layer tape having distinct signal, power and ground planes, semiconductor device assembly employing same, apparatus for and method of assembling same | 22 | 1996 | |
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| 4,941,033 Semiconductor integrated circuit device | 70 | 1989 | |
| 4,942,140 Method of packaging semiconductor device | 79 | 1989 | |
| 4,967,261 Tape carrier for assembling an IC chip on a substrate | 59 | 1989 | |
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| 4,700,473 Method of making an ultra high density pad array chip carrier | 96 | 1986 | |
| 5,045,921 Pad array carrier IC device using flexible tape | 188 | 1989 | |
| 5,029,325 TAB tape translator for use with semiconductor devices | 36 | 1990 | |
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| 4,670,770 Integrated circuit chip-and-substrate assembly | 143 | 1984 | |
| 4,937,653 Semiconductor integrated circuit chip-to-chip interconnection scheme | 240 | 1988 | |
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| 4,189,825 Integrated test and assembly device | 67 | 1977 | |
| 5,027,191 Cavity-down chip carrier with pad grid array | 55 | 1989 | |
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| 4,649,415 Semiconductor package with tape mounted die | 65 | 1985 | |
| 4,751,199 Process of forming a compliant lead frame for array-type semiconductor packages | 106 | 1987 | |
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| 4,874,721 Method of manufacturing a multichip package with increased adhesive strength | 61 | 1988 | |
| 5,350,947 Film carrier semiconductor device | 59 | 1992 | |
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| 4,627,151 Automatic assembly of integrated circuits | 57 | 1984 | |
| 4,685,998 Process of forming integrated circuits with contact pads in a standard array | 140 | 1986 | |
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| 4,887,148 Pin grid array package structure | 38 | 1988 | |
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| 4,866,841 Integrated circuit chip carrier | 29 | 1988 | |
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| 4,410,905 Power, ground and decoupling structure for chip carriers | 77 | 1981 | |
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| RE35119 Textured metallic compression bonding | 59 | 1992 | |
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| 4,842,662 Process for bonding integrated circuit components | 62 | 1988 | |
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| 4,793,814 Electrical circuit board interconnect | 254 | 1986 | |
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| 4,237,607 Method of assembling semiconductor integrated circuit | 51 | 1978 | |
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| 4,975,765 Highly integrated circuit and method for the production thereof | 74 | 1989 | |
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| 4,751,482 Semiconductor integrated circuit device having a multi-layered wiring board for ultra high speed connection | 70 | 1986 | |
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| 5,055,913 Terminal arrangement for integrated circuit device | 36 | 1989 | |
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| 4,897,534 Data carrier having an integrated circuit and a method for producing the same | 45 | 1987 | |
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| 4,855,872 Leadless ceramic chip carrier printed wiring board adapter | 22 | 1987 | |
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| 5,053,922 Demountable tape-automated bonding system | 46 | 1989 | |
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| 4,954,878 Method of packaging and powering integrated circuit chips and the chip assembly formed thereby | 138 | 1989 | |
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| 4,961,105 Arrangement of a semiconductor device for use in a card | 51 | 1989 | |
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| 4,924,353 Connector system for coupling to an integrated circuit chip | 98 | 1988 | |
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| 4,878,098 Semiconductor integrated circuit device | 46 | 1989 | |
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| 4,356,374 Electronics circuit device and method of making the same | 50 | 1980 | |
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| 4,628,406 Method of packaging integrated circuit chips, and integrated circuit package | 70 | 1985 | |
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| 5,227,583 Ceramic package and method for making same | 24 | 1991 | |
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| 4,814,295 Mounting of semiconductor chips on a plastic substrate | 84 | 1986 | |
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| 4,710,798 Integrated circuit chip package | 120 | 1985 | |
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| 4,721,993 Interconnect tape for use in tape automated bonding | 44 | 1986 | |
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| 5,023,205 Method of fabricating hybrid circuit structures | 37 | 1989 | |
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| 4,655,524 Solderless connection apparatus | 54 | 1985 | |
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| 4,818,728 Method of making a hybrid semiconductor device | 266 | 1987 | |
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| 5,477,082 Bi-planar multi-chip module | 217 | 1994 | |
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| 5,394,009 Tab semiconductor package with cushioned land grid array outer lead bumps | 99 | 1993 | |
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| 4,597,617 Pressure interconnect package for integrated circuits | 114 | 1984 | |
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| 5,454,160 Apparatus and method for stacking integrated circuit devices | 121 | 1993 | |
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| 4,993,954 Device for interconnection between and integrated circuit and an electrical circuit | 19 | 1989 | |
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| 5,217,916 Method of making an adaptive configurable gate array | 61 | 1991 | |
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| 4,681,654 Flexible film semiconductor chip carrier | 86 | 1986 | |
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| 4,772,936 Pretestable double-sided tab design | 76 | 1987 | |
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| 5,637,919 Perimeter independent precision locating member | 35 | 1995 | |