Semiconductor device having a plurality of semiconductor chips
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Oct 17, 2000
Grant Date -
N/A
app pub date -
Sep 18, 1998
filing date -
Jan 24, 1997
priority date (Note) -
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Abstract
A semiconductor device includes first and second semiconductor chips. The first semiconductor chip is formed with a plurality of first electrodes on a surface thereof, while the second semiconductor chip is formed with a plurality of second electrodes on a surface thereof. These surfaces are positioned facing to each other, thereby connecting between the first electrode and the second electrode. The respective surfaces are formed with circuit elements. The circuit elements are covered by the first semiconductor chip and the second semiconductor chip The first semiconductor chip and the second semiconductor chip at their connecting portions are encapsulated by a synthetic resin that is excellent in moisture resistance. The first semiconductor chip and the second semiconductor chip are entirely packaged by a second synthetic resin that is excellent in adhesibility.
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