Substrate system for spray forming
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United States of America Patent
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Oct 24, 2000
Grant Date -
N/A
app pub date -
Mar 5, 1998
filing date -
Mar 5, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A substrate system for receiving a deposit of sprayed metal droplets including a movable outer substrate on which the sprayed metal droplets are deposited. The substrate system also includes an inner substrate disposed adjacent the outer substrate where the sprayed metal droplets are deposited on the outer substrate. The inner substrate includes zones of differing thermal conductivity to resist substrate layer porosity and to resist formation of large grains and coarse constituent particles in a bulk layer of the metal droplets which have accumulated on the outer substrate. A spray forming apparatus and associated method of spray forming a molten metal to form a metal product using the substrate system of the invention is also provided.
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