Groove cleaning device for chemical-mechanical polishing
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United States of America Patent
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Oct 24, 2000
Grant Date -
N/A
app pub date -
Feb 11, 1998
filing date -
Feb 11, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An improved chemical-mechanical polishing method and apparatus is provided. A brush is employed to continually brush slurry particles from surface features, e.g., grooves, on a polishing pad. In this manner slurry is prevented from becoming compacted within the grooves as the slurry passes beneath and is subjected to compressive forces of a wafer polishing head. The invention may be practiced by use of a stationary brush operatively coupled to the polishing pad surface, or by an improved conditioning assembly having both a diamond surface for conditioning the polishing pad and a brush for cleaning the pad's surface features. The brush portion of the conditioning assembly may or may not rotate as it is scanned across the surface of the polishing pad.
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Cited Art Landscape
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