Importance

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Abstract

The invention involves technology related to chemical mechanical polishing using a chemical mechanical polishing apparatus having a wafer carrier for holding a semiconductor wafer, a polishing platen which is able to be rotated and which is positioned facing the surface of the wafer carrier on which the wafer is held, and a circular polishing cloth mounted on the polishing platen for polishing the semiconductor wafer, the polishing cloth having a smaller diameter than the diameter of the semiconductor wafer, and the polishing platen being movable horizontally across the surface of the semiconductor wafer. While rotating the semiconductor wafer held on the wafer carrier, the polishing platen is moved horizontally across the surface of the semiconductor wafer so that the displacement velocity of the polishing platen is slower at a central portion of the semiconductor wafer than at an outer portion, and the surface of the semiconductor wafer is polished with the polishing cloth. As a result, polishing uniformity is improved.

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First Claim