Two layer hermetic-like coating for on-wafer encapsulatuon of GaAs MMIC's having flip-chip bonding capabilities
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United States of America Patent
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Oct 24, 2000
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N/A
app pub date -
Feb 6, 1998
filing date -
Dec 21, 1995
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Abstract
The present invention is drawn to a 2-layer hermetic coating for on wafer encapsulation of GaAs monolithic microwave integrated circuits and the flip-chip mounting thereof. The present invention utilizes the properties of benzocyclobutene (BCB) for use in high frequency microwave applications to capacitively decoupled the MMIC from the carrier substrate during the flip-chip mounting process. The present invention has the advantage of improved performance and reliable flip-chip mounting by the reduction in stress between the carrier substrate and the MMIC that often occurs in flip-chip mounting of the MMIC.
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