Multiple stage wet processing platform and method of use

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 6138694
SERIAL NO

09263384

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A multiple stage wet processing platform includes a sealable enclosure, at least two processing modules positioned within the enclosure, at least one of them including a housing having an opening and a door moveable into position covering the opening, at least two processing vessels within the housing, and an intra-module robot within the housing and including a wafer support member, the intra-module robot moveable to a first position in which the support is disposed in a first one of the processing vessels and a second position in which the support is disposed in a second one of the processing vessels. An inter-module robot is positioned within the enclosure and is moveable between a first position adjacent to a first one of the modules and a second position adjacent to a second one of the modules.

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Patent Owner(s)

Patent OwnerAddress
SCP SERVICES INC6330 HEDGEWOOD DRIVE SUITE 150 ALLENTOWN PA 18106

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Becia, William Warren Boise, ID 2 24
Hall, Randy Mark Meridian, ID 2 24
Hansen, Eric T Boise, ID 9 67
Ives, Thomas Wayne Boise, ID 10 50
Krawzak, Thomas Boise, ID 3 22
Mimken, Victor B Boise, ID 9 91

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