Microcapsules used in image-forming substrate and process of producing same

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United States of America Patent

PATENT NO 6139914
SERIAL NO

09177565

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Abstract

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A microcapsule includes a shape memory resin shell wall formed with fissures that do not completely pass through the shell wall, and a dye encapsulated in the shell wall. The shell wall exhibits a temperature/pressure characteristic such that the fissures open, when the shell wall is squashed and compacted under a predetermined pressure at a predetermined temperature, whereby a seepage of the dye frog the squashed and compacted shell wall through the opened fissures is adjustable.

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Patent Owner(s)

Patent OwnerAddress
ASAHI KOGAKU KOGYO KABUSHIKI KAISHA36-9 MAENOCHO 2-CHOME ITABASHI-KU TOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Furusawa, Koichi Tokyo, JP 47 1131
Orita, Hiroshi Saitama, JP 40 361
Saito, Hiroyuki Saitama, JP 420 5145
Suzuki, Katsuyoshi Tokyo, JP 147 1653
Suzuki, Minoru Tochigi, JP 316 4215

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