Plasma enhancement apparatus and method for physical vapor deposition
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United States of America Patent
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Oct 31, 2000
Issued Date -
N/A
app pub date -
Jun 6, 1995
filing date -
Apr 22, 1991
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The present invention provides a plasma enhancement method and apparatus for electric arc vapor deposition. The plasma enhancement apparatus is positioned to act upon plasma generated from a plasma source before the plasma reaches a substrate to be coated by the plasma. The plasma enhancement apparatus includes a magnet disposed about a magnet axis and defining a first aperture, and a core member disposed about a core member axis and at least partially nested within the first aperture. The core member defines a second aperture, and the plasma enhancement apparatus is arranged and configured in such a manner that the evaporated cathode source material passes from the cathode source and through the second aperture toward the substrate to be coated by the evaporated cathode source material. The plasma is favorably conditioned as it passes through the plasma enhancement apparatus.
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