US Patent No: 6,140,144

Number of patents in Portfolio can not be more than 2000

Method for packaging microsensors

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Abstract

A method for packaging and protection of sensors, particularly so called microsensors is disclosed. A sensor unit (either a sensor chip or sensor package) is flip chip bonded to a substrate having a through hole, such that the sensing element is placed above the through hole. An underfill material is applied in such a way that due to capillary forces, the entire common area between the sensor and the substrate is completely filled, while the sensing element is not covered by the underfill material. This provides an effective way of sealing the sensing element from the side of the package containing the electronics. For a sensor chip that has been through a first level packaging process, the above mentioned method can still be used for bonding the sensor package to a substrate containing an access hole. For some applications one or multiple layers of protective coatings can be deposited on either one side or both sides of the sensor package for protection against the operating environment. For applications where the sensor is required to operate in a controlled pressure/controlled gas environment, a cavity can be created into the substrate, and the sensor chip can be flip chip bonded (and/or sealed) to the substrate in a controlled environment. An alternative method of packaging is disclosed where the sensor chip is fixed onto the substrate, and a cap is bonded to this substrate using dummy bumps for mechanical strength.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
INTEGRATED SENSING SYSTEMS, INC.YPSILANTI, MI45

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Massoud-Ansari, Sonbol Ann Arbor, MI 15 249
Najafi, Nader Ann Arbor, MI 72 632

Cited Art

Patent Info (Count) # Cites Year
 
FREESCALE SEMICONDUCTOR, INC. (4)
5,646,072 Electronic sensor assembly having metal interconnections isolated from adverse media 16 1995
5,889,211 Media compatible microsensor structure and methods of manufacturing and using the same 18 1995
5,600,071 Vertically integrated sensor structure and method 44 1996
5,994,161 Temperature coefficient of offset adjusted semiconductor device and method thereof 12 1997
 
DELPHI TECHNOLOGIES, INC. (1)
5,209,122 Pressurer sensor and method for assembly of same 21 1991
 
HONEYWELL INC. (1)
4,763,098 Flip-chip pressure transducer 30 1985
 
INFINEON TECHNOLOGIES AG (1)
5,591,679 Sealed cavity arrangement method 50 1996
 
INVENSYS SYSTEMS, INC. (1)
5,285,690 Pressure sensor having a laminated substrate 22 1992
 
MITSUBISHI DENKI KABUSHIKI KAISHA (1)
5,721,446 Semiconductor pressure sensor with spacing member disposed between sensor and substrate 11 1997
 
NIPPONDENSO CO., LTD. (1)
4,838,089 Semiconductor pressure sensor 33 1987

Patent Citation Ranking

Forward Cites

Patent Info (Count) # Cites Year
 
AMKOR TECHNOLOGY, INC. (7)
6,415,505 Micromachine package fabrication method 5 1999
6,441,503 Bond wire pressure sensor die package 23 2001
6,432,737 Method for forming a flip chip pressure sensor die package 35 2001
6,624,921 Micromirror device package fabrication method 22 2001
6,455,927 Micromirror device package 57 2001
6,661,080 Structure for backside saw cavity protection 5 2001
6,586,824 Reduced thickness packaged electronic device 14 2001
 
HONEYWELL INTERNATIONAL INC. (7)
6,914,323 Methods and apparatus for attaching getters to MEMS device housings 7 2003
6,987,304 Methods and apparatus for particle reduction in MEMS devices 2 2003
7,077,008 Differential pressure measurement using backside sensing and a single ASIC 8 2004
7,635,077 Method of flip chip mounting pressure sensor dies to substrates and pressure sensors formed thereby 3 2005
7,297,573 Methods and apparatus for particle reduction in MEMS devices 1 2005
7,491,567 MEMS device packaging methods 4 2005
8,061,212 Method of flip chip mounting pressure sensor dies to substrates and pressure sensors formed thereby 0 2009
 
DENSO CORPORATION (5)
6,591,689 Sensor held by base having lead 8 2001
6,781,208 Functional device, method of manufacturing therefor and driver circuit 6 2002
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7,026,698 Functional device, method of manufacturing therefor and driver circuit 1 2004
8,156,804 Capacitive semiconductor sensor 0 2007
 
INTEL CORPORATION (5)
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6,903,452 Packaging microelectromechanical structures 53 2003
7,087,451 Microfabricated hot wire vacuum sensor 1 2004
 
TESSERA TECHNOLOGIES HUNGARY KFT. (5)
7,265,440 Methods and apparatus for packaging integrated circuit devices 17 2005
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TESSERA, INC. (5)
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ROBERT BOSCH GMBH (4)
7,335,971 Method for protecting encapsulated sensor structures using stack packaging 2 2003
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3M INNOVATIVE PROPERTIES COMPANY (3)
6,834,154 Tooling fixture for packaged optical micro-mechanical devices 0 2001
6,798,954 Packaged optical micro-mechanical device 0 2001
6,771,859 Self-aligning optical micro-mechanical device package 3 2001
 
ALTERA CORPORATION (3)
6,809,384 Method and apparatus for protecting wiring and integrated circuit device 1 2002
7,002,215 Floating entrance guard for preventing electrical short circuits 0 2002
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ROUND ROCK RESEARCH, LLC (3)
7,443,038 Flip-chip image sensor packages 2 2005
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8,097,895 Electronic device package with an optical device 0 2009
 
SAMSUNG ELECTRONICS CO., LTD. (3)
6,818,542 Tape circuit board and semiconductor chip package including the same 0 2004
7,263,883 Gyro-sensor comprising a plurality of component units, and fabricating method thereof 0 2005
7,468,556 Packaging of hybrid integrated circuits 5 2007
 
ENDOVASCULAR TECHNOLOGIES, INC. (2)
7,261,733 Endovascular graft with sensors design and attachment methods 10 2002
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INFINEON TECHNOLOGIES AG (2)
7,445,959 Sensor module and method of manufacturing same 4 2006
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MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (2)
6,549,105 Millimeter wave module and radio apparatus 0 2001
6,778,041 Millimeter wave module and radio apparatus 3 2003
 
MEGICA CORPORATION (2)
7,045,901 Chip-on-chip connection with second chip located in rectangular open window hole in printed circuit board 37 2003
8,148,806 Multiple chips bonded to packaging structure with low noise and multiple selectable functions 1 2008
 
RESEARCH TRIANGLE INSTITUTE (2)
6,906,598 Three dimensional multimode and optical coupling devices 3 2002
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SENSIRION HOLDING AG (2)
6,750,522 Sensor accommodated in a housing 5 2002
7,704,774 Pressure sensor having a chamber and a method for fabricating the same 2 2007
 
SHINKO ELECTRIC INDUSTRIES CO., LTD. (2)
7,456,497 Electronic devices and its production methods 53 2003
8,216,884 Production methods of electronic devices 0 2008
 
SILEX MICROSYSTEMS AB (2)
6,973,835 Pressure sensor 4 2002
7,207,227 Pressure sensor 1 2005
 
TELEDYNE DALSA SEMICONDUCTOR INC. (2)
6,635,509 Wafer-level MEMS packaging 118 2002
6,902,656 Fabrication of microstructures with vacuum-sealed cavity 17 2002
 
VITAL SENSORS HOLDING COMPANY (2)
7,686,768 Implantable pressure monitor 3 2006
8,376,953 Implantable pressure monitor 0 2011
 
VITAL SENSORS HOLDING COMPANY, INC. (2)
7,931,597 Anchored implantable pressure monitor 2 2010
7,931,598 Implantable pressure monitor 4 2010
 
ADVANCED SEMICONDUCTOR ENGINEERING, INC. (1)
7,049,689 Chip on glass package 3 2004
 
ALCHIMER (1)
7,247,226 Coating support and method for the selective coating of conductive tracks on one such support 1 2003
 
ATI TECHNOLOGIES INC. (1)
6,929,976 Multi-die module and method thereof 5 2003
 
BROOKS INSTRUMENT, LLC (1)
7,941,284 Systems, apparatuses, and methods for measuring a fluid characteristic using a coriolis flow meter 0 2009
 
ENDO VASCULAR TECHNOLOGIES, INC. (1)
7,399,313 Endovascular graft with separable sensors 13 2003
 
ENDOTRONIX, INC. (1)
8,154,389 Wireless sensor reader 0 2009
 
ENDRESS + HAUSER CONDUCTA GESELLSCHAFT FUR MESS- UND REGELTECHNIK MBH + CO. KG (1)
7,799,606 Semiconductor sensor having a front-side contact zone 0 2003
 
EPCOS AG (1)
8,110,962 MEMS component and method for production 1 2009
 
FREESCALE SEMICONDUCTOR, INC. (1)
6,800,946 Selective underfill for flip chips and flip-chip assemblies 14 2002
 
FUENCE CO., LTD. (1)
7,687,031 Microchip 0 2002
 
FUJI XEROX CO., LTD. (1)
8,166,835 Sensor chip and inspection device 0 2008
 
GENERAL ELECTRIC COMPANY (1)
7,053,425 Gas sensor device 8 2003
 
GEORGIA TECH RESEARCH CORPORATION (1)
6,458,618 Robust substrate-based micromachining techniques and their application to micromachined sensors and actuators 8 2000
 
HITACHI, LTD. (1)
6,410,978 Semiconductor device 0 1999
 
HTC BETEILIGUNGS GMBH (1)
8,026,583 Flip-chip module and method for the production thereof 0 2006
 
HUGHES ELECTRONICS CORPORATION (1)
6,573,124 Preparation of passivated chip-on-board electronic devices 3 1999
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (1)
6,599,774 Technique for underfilling stacked chips on a cavity MLC module 5 2001
 
IP VERWERTUNGS GMBH (1)
6,518,084 Method of producing a micromechanical structure for a micro-electromechanical element 12 2001
 
KAVLICO CORPORATION (1)
7,162,926 Lead embedded pressure sensor 11 2005
 
LENGHWAYS TECHNOLOGY CO., LTD. (1)
6,607,934 Micro-electromechanical process for fabrication of integrated multi-frequency communication passive components 18 2001
 
MITSUBISHI DENKI KABUSHIKI KAISHA (1)
6,316,840 Semiconductor device 56 2000
 
MORGAN RESEARCH CORPORATION (1)
7,748,272 MEMS sensor suite on a chip 1 2008
 
MURATA MANUFACTURING CO., LTD. (1)
6,300,676 Small size electronic part and a method for manufacturing the same, and a method for forming a via hole for use in the same 10 1999
 
NXP B.V. (1)
8,153,480 Air cavity package for flip-chip 0 2006
 
SANDIA CORPORATION (1)
6,844,623 Temporary coatings for protection of microelectronic devices during packaging 18 2001
 
SANYU REC CO., LTD. (1)
6,579,748 Fabrication method of an electronic component 30 2000
 
SITIME CORPORATION (1)
8,324,729 Stacked die package for MEMS resonator system 0 2011
 
SKYWORKS SOLUTIONS, INC. (1)
8,324,728 Wafer level packaging using flip chip mounting 0 2008
 
SONY CORPORATION (1)
7,654,139 Vibratory gyrosensor having a vibration element provided with terminals 1 2006
 
WAFER-LEVEL PACKAGING PORTFOLIO LLC (1)
8,017,435 Method for packaging electronic devices and integrated circuits 0 2007