US Patent No: 6,140,144

Number of patents in Portfolio can not be more than 2000

Method for packaging microsensors

2 Status Updates

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

A method for packaging and protection of sensors, particularly so called microsensors is disclosed. A sensor unit (either a sensor chip or sensor package) is flip chip bonded to a substrate having a through hole, such that the sensing element is placed above the through hole. An underfill material is applied in such a way that due to capillary forces, the entire common area between the sensor and the substrate is completely filled, while the sensing element is not covered by the underfill material. This provides an effective way of sealing the sensing element from the side of the package containing the electronics. For a sensor chip that has been through a first level packaging process, the above mentioned method can still be used for bonding the sensor package to a substrate containing an access hole. For some applications one or multiple layers of protective coatings can be deposited on either one side or both sides of the sensor package for protection against the operating environment. For applications where the sensor is required to operate in a controlled pressure/controlled gas environment, a cavity can be created into the substrate, and the sensor chip can be flip chip bonded (and/or sealed) to the substrate in a controlled environment. An alternative method of packaging is disclosed where the sensor chip is fixed onto the substrate, and a cap is bonded to this substrate using dummy bumps for mechanical strength.

Loading the Abstract Image... loading....

First Claim

See full text

all claims..

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddressTotal Patents
INTEGRATED SENSING SYSTEMS, INC.YPSILANTI, MI49

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Massoud-Ansari, Sonbol Ann Arbor, MI 15 375
Najafi, Nader Ann Arbor, MI 93 1010

Cited Art Landscape

Patent Info (Count) # Cites Year
 
FREESCALE SEMICONDUCTOR, INC. (4)
* 5,646,072 Electronic sensor assembly having metal interconnections isolated from adverse media 16 1995
* 5,889,211 Media compatible microsensor structure and methods of manufacturing and using the same 24 1995
* 5,600,071 Vertically integrated sensor structure and method 48 1996
* 5,994,161 Temperature coefficient of offset adjusted semiconductor device and method thereof 14 1997
 
DELPHI TECHNOLOGIES, INC. (1)
* 5,209,122 Pressurer sensor and method for assembly of same 21 1991
 
Honeywell Inc. (1)
* 4,763,098 Flip-chip pressure transducer 33 1985
 
INFINEON TECHNOLOGIES AG (1)
* 5,591,679 Sealed cavity arrangement method 55 1996
 
INVENSYS SYSTEMS, INC. (1)
* 5,285,690 Pressure sensor having a laminated substrate 26 1992
 
MITSUBISHI DENKI KABUSHIKI KAISHA (1)
* 5,721,446 Semiconductor pressure sensor with spacing member disposed between sensor and substrate 11 1997
 
Nippondenso Co., Ltd. (1)
* 4,838,089 Semiconductor pressure sensor 34 1987
* Cited By Examiner

Patent Citation Ranking

Forward Cite Landscape

Patent Info (Count) # Cites Year
 
KNOWLES ELECTRONICS, LLC (14)
8,629,551 Bottom port surface mount silicon condenser microphone package 0 2012
8,624,384 Bottom port surface mount silicon condenser microphone package 0 2012
8,704,360 Top port surface mount silicon condenser microphone package 0 2012
8,629,552 Top port multi-part surface mount silicon condenser microphone package 0 2012
8,624,385 Top port surface mount silicon condenser microphone package 0 2012
8,624,386 Bottom port multi-part surface mount silicon condenser microphone package 0 2012
8,624,387 Top port multi-part surface mount silicon condenser microphone package 0 2012
8,765,530 Methods of manufacture of top port surface mount silicon condenser microphone packages 0 2013
8,652,883 Methods of manufacture of bottom port surface mount silicon condenser microphone packages 0 2013
8,633,064 Methods of manufacture of top port multipart surface mount silicon condenser microphone package 0 2013
8,629,005 Methods of manufacture of bottom port surface mount silicon condenser microphone packages 0 2013
8,623,709 Methods of manufacture of top port surface mount silicon condenser microphone packages 0 2013
8,623,710 Methods of manufacture of bottom port multi-part surface mount silicon condenser microphone packages 0 2013
8,617,934 Methods of manufacture of top port multi-part surface mount silicon condenser microphone packages 0 2013
 
AMKOR TECHNOLOGY, INC. (7)
6,415,505 Micromachine package fabrication method 5 1999
* 6,441,503 Bond wire pressure sensor die package 39 2001
6,432,737 Method for forming a flip chip pressure sensor die package 35 2001
6,624,921 Micromirror device package fabrication method 24 2001
* 6,455,927 Micromirror device package 60 2001
6,661,080 Structure for backside saw cavity protection 5 2001
6,586,824 Reduced thickness packaged electronic device 16 2001
 
HONEYWELL INTERNATIONAL INC. (7)
6,914,323 Methods and apparatus for attaching getters to MEMS device housings 7 2003
6,987,304 Methods and apparatus for particle reduction in MEMS devices 2 2003
* 7,077,008 Differential pressure measurement using backside sensing and a single ASIC 17 2004
7,635,077 Method of flip chip mounting pressure sensor dies to substrates and pressure sensors formed thereby 9 2005
7,297,573 Methods and apparatus for particle reduction in MEMS devices 1 2005
7,491,567 MEMS device packaging methods 6 2005
8,061,212 Method of flip chip mounting pressure sensor dies to substrates and pressure sensors formed thereby 5 2009
 
DENSO CORPORATION (5)
* 6,591,689 Sensor held by base having lead 9 2001
* 6,781,208 Functional device, method of manufacturing therefor and driver circuit 7 2002
* 6,787,384 Functional device, method of manufacturing therefor and driver circuit 41 2003
* 7,026,698 Functional device, method of manufacturing therefor and driver circuit 1 2004
* 8,156,804 Capacitive semiconductor sensor 2 2007
 
INTEL CORPORATION (5)
* 6,461,891 Method of constructing an electronic assembly having an indium thermal couple and an electronic assembly having an indium thermal couple 6 1999
6,504,242 Electronic assembly having a wetting layer on a thermally conductive heat spreader 38 2001
6,882,043 Electronic assembly having an indium thermal couple 4 2002
* 6,903,452 Packaging microelectromechanical structures 58 2003
* 7,087,451 Microfabricated hot wire vacuum sensor 1 2004
 
TESSERA TECHNOLOGIES HUNGARY KFT. (5)
7,265,440 Methods and apparatus for packaging integrated circuit devices 29 2005
7,936,062 Wafer level chip packaging 8 2007
7,495,341 Methods and apparatus for packaging integrated circuit devices 13 2007
7,642,629 Methods and apparatus for packaging integrated circuit devices 9 2007
7,479,398 Methods and apparatus for packaging integrated circuit devices 3 2007
 
TESSERA, INC. (5)
7,566,955 High-frequency chip packages 18 2002
7,298,030 Structure and method of making sealed capped chips 30 2004
7,224,056 Back-face and edge interconnects for lidded package 9 2004
7,129,576 Structure and method of making capped chips including vertical interconnects having stud bumps engaged to surfaces of said caps 18 2004
8,143,095 Sequential fabrication of vertical conductive interconnects in capped chips 2 2005
 
ROBERT BOSCH GMBH (4)
* 7,335,971 Method for protecting encapsulated sensor structures using stack packaging 5 2003
* 7,696,001 Method for mounting semiconductor chips on a substrate and corresponding assembly 0 2006
* 7,802,481 High-pressure sensor device and method for manufacturing same 3 2006
7,859,093 Method for protecting encapsulated sensor structures using stack packaging 0 2007
 
3M INNOVATIVE PROPERTIES COMPANY (3)
6,834,154 Tooling fixture for packaged optical micro-mechanical devices 0 2001
6,798,954 Packaged optical micro-mechanical device 0 2001
6,771,859 Self-aligning optical micro-mechanical device package 3 2001
 
ALTERA CORPORATION (3)
6,809,384 Method and apparatus for protecting wiring and integrated circuit device 1 2002
* 7,002,215 Floating entrance guard for preventing electrical short circuits 0 2002
6,908,781 Method and apparatus for protecting wiring and integrated circuit device 2 2004
 
ENDOTRONIX, INC. (3)
8,894,582 Cardiac pressure monitoring device 0 2008
8,154,389 Wireless sensor reader 0 2009
8,493,187 Wireless sensor reader 0 2010
 
INFINEON TECHNOLOGIES AG (3)
* 7,445,959 Sensor module and method of manufacturing same 5 2006
* 7,994,618 Sensor module and method for manufacturing same 3 2006
8,674,462 Sensor package 0 2007
 
ROUND ROCK RESEARCH, LLC (3)
* 7,443,038 Flip-chip image sensor packages 2 2005
7,638,813 Methods of fabrication for flip-chip image sensor packages 16 2006
8,097,895 Electronic device package with an optical device 0 2009
 
SAMSUNG ELECTRONICS CO., LTD. (3)
* 6,818,542 Tape circuit board and semiconductor chip package including the same 1 2004
* 7,263,883 Gyro-sensor comprising a plurality of component units, and fabricating method thereof 3 2005
7,468,556 Packaging of hybrid integrated circuits 8 2007
 
SITIME CORPORATION (3)
* 8,324,729 Stacked die package for MEMS resonator system 1 2011
* 2011/0227,175 Stacked Die Package for MEMS Resonator System 1 2011
8,669,664 Stacked die package for MEMS resonator system 0 2012
 
SKYWORKS SOLUTIONS, INC. (3)
8,900,931 In-situ cavity integrated circuit package 0 2007
8,324,728 Wafer level packaging using flip chip mounting 2 2008
* 8,809,116 Method for wafer level packaging of electronic devices 0 2012
 
FREESCALE SEMICONDUCTOR, INC. (2)
* 6,800,946 Selective underfill for flip chips and flip-chip assemblies 19 2002
* 8,468,887 Resonant accelerometer with low sensitivity to package stress 0 2008
 
LIFESHIELD SCIENCES LLC (2)
7,261,733 Endovascular graft with sensors design and attachment methods 16 2002
7,918,800 Aneurysm sensing devices and delivery systems 0 2004
 
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (2)
* 6,549,105 Millimeter wave module and radio apparatus 0 2001
6,778,041 Millimeter wave module and radio apparatus 3 2003
 
QUALCOMM INCORPORATED (2)
* 7,045,901 Chip-on-chip connection with second chip located in rectangular open window hole in printed circuit board 63 2003
8,148,806 Multiple chips bonded to packaging structure with low noise and multiple selectable functions 7 2008
 
RESEARCH TRIANGLE INSTITUTE (2)
6,906,598 Three dimensional multimode and optical coupling devices 3 2002
7,042,306 Three dimensional multimode and optical coupling devices 3 2004
 
SANDIA CORPORATION (2)
* 6,844,623 Temporary coatings for protection of microelectronic devices during packaging 26 2001
* 8,597,985 MEMS packaging with etching and thinning of lid wafer to form lids and expose device wafer bond pads 0 2012
 
SENSIRION AG (2)
8,791,532 Sensor mounted in flip-chip technology on a substrate 0 2009
8,736,002 Sensor mounted in flip-chip technology at a substrate edge 0 2009
 
SENSIRION HOLDING AG (2)
* 6,750,522 Sensor accommodated in a housing 7 2002
7,704,774 Pressure sensor having a chamber and a method for fabricating the same 8 2007
 
SHINKO ELECTRIC INDUSTRIES CO., LTD. (2)
7,456,497 Electronic devices and its production methods 63 2003
8,216,884 Production methods of electronic devices 0 2008
 
SILEX MICROSYSTEMS AB (2)
* 6,973,835 Pressure sensor 5 2002
7,207,227 Pressure sensor 5 2005
 
TELEDYNE DALSA SEMICONDUCTOR INC. (2)
6,635,509 Wafer-level MEMS packaging 144 2002
6,902,656 Fabrication of microstructures with vacuum-sealed cavity 21 2002
 
VITAL SENSORS HOLDING COMPANY (2)
* 7,686,768 Implantable pressure monitor 3 2006
* 8,376,953 Implantable pressure monitor 0 2011
 
VITAL SENSORS HOLDING COMPANY, INC. (2)
* 7,931,597 Anchored implantable pressure monitor 2 2010
* 7,931,598 Implantable pressure monitor 4 2010
 
ADVANCED SEMICONDUCTOR ENGINEERING, INC. (1)
7,049,689 Chip on glass package 3 2004
 
ALCHIMER (1)
7,247,226 Coating support and method for the selective coating of conductive tracks on one such support 1 2003
 
AMPHENOL THERMOMETRICS, INC. (1)
* 7,053,425 Gas sensor device 13 2003
 
ATI TECHNOLOGIES INC. (1)
* 6,929,976 Multi-die module and method thereof 5 2003
 
BROOKS INSTRUMENT, LLC (1)
7,941,284 Systems, apparatuses, and methods for measuring a fluid characteristic using a coriolis flow meter 0 2009
 
ENDO VASCULAR TECHNOLOGIES, INC. (1)
7,399,313 Endovascular graft with separable sensors 19 2003
 
ENDRESS + HAUSER CONDUCTA GESELLSCHAFT FUR MESS- UND REGELTECHNIK MBH + CO. KG (1)
* 7,799,606 Semiconductor sensor having a front-side contact zone 0 2003
 
EPCOS AG (1)
* 8,110,962 MEMS component and method for production 1 2009
 
FUENCE CO., LTD. (1)
* 7,687,031 Microchip 0 2002
 
FUJI XEROX CO., LTD. (1)
* 8,166,835 Sensor chip and inspection device 0 2008
 
GEORGIA TECH RESEARCH CORPORATION (1)
* 6,458,618 Robust substrate-based micromachining techniques and their application to micromachined sensors and actuators 8 2000
 
HITACHI, LTD. (1)
* 6,410,978 Semiconductor device 0 1999
 
HTC BETEILIGUNGS GMBH (1)
* 8,026,583 Flip-chip module and method for the production thereof 0 2006
 
HUGHES ELECTRONICS CORPORATION (1)
* 6,573,124 Preparation of passivated chip-on-board electronic devices 4 1999
 
INTEGRATED SENSING SYSTEMS, INC. (1)
8,715,300 Delivery system, method, and anchor for medical implant placement 0 2011
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (1)
* 6,599,774 Technique for underfilling stacked chips on a cavity MLC module 6 2001
 
INVENSAS CORPORATION (1)
8,604,605 Microelectronic assembly with multi-layer support structure 0 2007
 
IP VERWERTUNGS GMBH (1)
* 6,518,084 Method of producing a micromechanical structure for a micro-electromechanical element 13 2001
 
KAVLICO CORPORATION (1)
* 7,162,926 Lead embedded pressure sensor 15 2005
 
LENGHWAYS TECHNOLOGY CO., LTD. (1)
* 6,607,934 Micro-electromechanical process for fabrication of integrated multi-frequency communication passive components 22 2001
 
MITSUBISHI DENKI KABUSHIKI KAISHA (1)
* 6,316,840 Semiconductor device 63 2000
 
MORGAN RESEARCH CORPORATION (1)
* 7,748,272 MEMS sensor suite on a chip 3 2008
 
MURATA MANUFACTURING CO., LTD. (1)
* 6,300,676 Small size electronic part and a method for manufacturing the same, and a method for forming a via hole for use in the same 10 1999
 
NXP B.V. (1)
* 8,153,480 Air cavity package for flip-chip 0 2006
 
SANYU REC CO., LTD. (1)
* 6,579,748 Fabrication method of an electronic component 31 2000
 
SONY CORPORATION (1)
* 7,654,139 Vibratory gyrosensor having a vibration element provided with terminals 2 2006
 
WAFER-LEVEL PACKAGING PORTFOLIO LLC (1)
* 8,017,435 Method for packaging electronic devices and integrated circuits 0 2007
 
WESTERN DIGITAL (FREMONT), LLC (1)
8,643,980 Micro-actuator enabling single direction motion of a magnetic disk drive head 4 2008
 
WESTERN DIGITAL TECHNOLOGIES, INC. (1)
8,756,776 Method for manufacturing a disk drive microactuator that includes a piezoelectric element and a peripheral encapsulation layer 2 2009
* Cited By Examiner