US Patent No: 6,140,144

Number of patents in Portfolio can not be more than 2000

Method for packaging microsensors

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Abstract

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A method for packaging and protection of sensors, particularly so called microsensors is disclosed. A sensor unit (either a sensor chip or sensor package) is flip chip bonded to a substrate having a through hole, such that the sensing element is placed above the through hole. An underfill material is applied in such a way that due to capillary forces, the entire common area between the sensor and the substrate is completely filled, while the sensing element is not covered by the underfill material. This provides an effective way of sealing the sensing element from the side of the package containing the electronics. For a sensor chip that has been through a first level packaging process, the above mentioned method can still be used for bonding the sensor package to a substrate containing an access hole. For some applications one or multiple layers of protective coatings can be deposited on either one side or both sides of the sensor package for protection against the operating environment. For applications where the sensor is required to operate in a controlled pressure/controlled gas environment, a cavity can be created into the substrate, and the sensor chip can be flip chip bonded (and/or sealed) to the substrate in a controlled environment. An alternative method of packaging is disclosed where the sensor chip is fixed onto the substrate, and a cap is bonded to this substrate using dummy bumps for mechanical strength.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
INTEGRATED SENSING SYSTEMS, INC.YPSILANTI, MI51

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Massoud-Ansari, Sonbol Ann Arbor, MI 12 432
Najafi, Nader Ann Arbor, MI 59 1361

Cited Art Landscape

Patent Info (Count) # Cites Year
 
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MITSUBISHI DENKI KABUSHIKI KAISHA (1)
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Honeywell Inc. (1)
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INFINEON TECHNOLOGIES AG (1)
* 5,591,679 Sealed cavity arrangement method 58 1996
* Cited By Examiner

Patent Citation Ranking

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Patent Info (Count) # Cites Year
 
Other [Check patent profile for assignment information] (4)
* 2003/0206,083 Millimeter wave module and radio apparatus 1 2003
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SAMSUNG ELECTRONICS CO., LTD. (8)
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6,415,505 Micromachine package fabrication method 5 1999
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6,661,080 Structure for backside saw cavity protection 6 2001
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SANDIA CORPORATION (2)
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8,643,980 Micro-actuator enabling single direction motion of a magnetic disk drive head 73 2008
 
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8,674,462 Sensor package 0 2007
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ATI TECHNOLOGIES INC. (1)
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FUJI XEROX CO., LTD. (1)
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MICRONIT MICROFLUIDICS B.V. (1)
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INTEGRATED SENSING SYSTEMS, INC. (1)
8,715,300 Delivery system, method, and anchor for medical implant placement 0 2011
 
ROUND ROCK RESEARCH, LLC (6)
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7,638,813 Methods of fabrication for flip-chip image sensor packages 19 2006
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8,097,895 Electronic device package with an optical device 0 2009
* 2010/0052,086 ELECTRONIC DEVICE PACKAGES AND METHODS OF FABRICATING ELECTRONIC DEVICE PACKAGES 3 2009
 
DENSO CORPORATION (8)
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* 2004/0209,393 Functional device, method of manufacturing therefor and driver circuit 0 2004
* 8,156,804 Capacitive semiconductor sensor 2 2007
* 2008/0093,740 Capacitive semiconductor sensor 3 2007
 
III HOLDINGS 6, LLC (2)
* 8,153,480 Air cavity package for flip-chip 0 2006
* 2009/0079,050 AIR CAVITY PACKAGE FOR FLIP-CHIP 4 2006
 
ROBERT BOSCH GMBH (10)
* 7,335,971 Method for protecting encapsulated sensor structures using stack packaging 7 2003
* 2004/0197,953 Method for protecting encapsulated sensor structures using stack packaging 3 2003
* 2005/0253,240 Micromechanical component and corresponsing production method 13 2004
* 2005/0194,685 Method for mounting semiconductor chips and corresponding semiconductor chip system 9 2005
* 7,696,001 Method for mounting semiconductor chips on a substrate and corresponding assembly 1 2006
* 2006/0220,258 Method for mounting semiconductor chips on a substrate and corresponding assembly 1 2006
* 7,802,481 High-pressure sensor device and method for manufacturing same 3 2006
* 2006/0278,002 High-pressure sensor device and method for manufacturing same 2 2006
7,859,093 Method for protecting encapsulated sensor structures using stack packaging 0 2007
* 2011/0198,674 GAS-SENSITIVE FIELD EFFECT TRANSISTOR AND METHOD FOR MANUFACTURING A GAS-SENSITIVE FIELD EFFECT TRANSISTOR 1 2011
 
INTEL CORPORATION (5)
* 6,461,891 Method of constructing an electronic assembly having an indium thermal couple and an electronic assembly having an indium thermal couple 6 1999
6,504,242 Electronic assembly having a wetting layer on a thermally conductive heat spreader 38 2001
6,882,043 Electronic assembly having an indium thermal couple 4 2002
* 6,903,452 Packaging microelectromechanical structures 69 2003
* 7,087,451 Microfabricated hot wire vacuum sensor 1 2004
 
ATI TECHNOLOGIES ULC (1)
* 2002/0195,704 Multi-die module and method thereof 1 2001
 
Sanyu Rec Co., Ltd. (1)
* 6,579,748 Fabrication method of an electronic component 33 2000
 
KNOWLES ELECTRONICS, LLC (29)
8,629,551 Bottom port surface mount silicon condenser microphone package 2 2012
8,624,384 Bottom port surface mount silicon condenser microphone package 15 2012
8,704,360 Top port surface mount silicon condenser microphone package 2 2012
8,629,552 Top port multi-part surface mount silicon condenser microphone package 15 2012
8,624,385 Top port surface mount silicon condenser microphone package 16 2012
8,624,386 Bottom port multi-part surface mount silicon condenser microphone package 15 2012
8,624,387 Top port multi-part surface mount silicon condenser microphone package 14 2012
8,765,530 Methods of manufacture of top port surface mount silicon condenser microphone packages 2 2013
8,652,883 Methods of manufacture of bottom port surface mount silicon condenser microphone packages 14 2013
8,633,064 Methods of manufacture of top port multipart surface mount silicon condenser microphone package 15 2013
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8,623,709 Methods of manufacture of top port surface mount silicon condenser microphone packages 16 2013
8,623,710 Methods of manufacture of bottom port multi-part surface mount silicon condenser microphone packages 15 2013
8,617,934 Methods of manufacture of top port multi-part surface mount silicon condenser microphone packages 15 2013
9,078,063 Microphone assembly with barrier to prevent contaminant infiltration 0 2013
9,061,893 Methods of manufacture of top port multi-part surface mount silicon condenser microphones 0 2013
9,156,684 Methods of manufacture of top port surface mount MEMS microphones 0 2014
9,139,421 Top port surface mount MEMS microphone 0 2014
9,051,171 Bottom port surface mount MEMS microphone 0 2014
9,040,360 Methods of manufacture of bottom port multi-part surface mount MEMS microphones 0 2014
9,023,689 Top port multi-part surface mount MEMS microphone 0 2014
9,024,432 Bottom port multi-part surface mount MEMS microphone 0 2014
9,150,409 Methods of manufacture of bottom port surface mount MEMS microphones 0 2014
9,139,422 Bottom port surface mount MEMS microphone 0 2014
9,006,880 Top port multi-part surface mount silicon condenser microphone 0 2014
9,096,423 Methods of manufacture of top port multi-part surface mount MEMS microphones 0 2014
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9,067,780 Methods of manufacture of top port surface mount MEMS microphones 0 2014
 
MITSUBISHI DENKI KABUSHIKI KAISHA (1)
* 6,316,840 Semiconductor device 65 2000
 
TEXAS INSTRUMENTS INCORPORATED (2)
* 2005/0132,803 Low cost integrated MEMS hybrid 3 2004
* 2006/0234,427 Underfill dispense at substrate aperture 2 2005
 
GEORGIA TECH RESEARCH CORPORATION (1)
* 6,458,618 Robust substrate-based micromachining techniques and their application to micromachined sensors and actuators 8 2000
 
ENDRESS + HAUSER CONDUCTA GESELLSCHAFT FUR MESS- UND REGELTECHNIK MBH + CO. KG (1)
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KAVLICO CORPORATION (2)
* 2007/0028,698 LEAD EMBEDDED PRESSURE SENSOR 4 2005
* 7,162,926 Lead embedded pressure sensor 16 2005
 
TRW AUTOMOTIVE U.S. LLC (2)
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* 2012/0210,787 MEASURING DEVICE MOUNTING METHOD AND STRUCTURE 0 2012
 
FREESCALE SEMICONDUCTOR, INC. (4)
* 6,800,946 Selective underfill for flip chips and flip-chip assemblies 21 2002
* 2004/0118,599 Selective underfill for flip chips and flip-chip assemblies 4 2002
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RESEARCH TRIANGLE INSTITUTE (3)
6,906,598 Three dimensional multimode and optical coupling devices 4 2002
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ALTERA CORPORATION (3)
6,809,384 Method and apparatus for protecting wiring and integrated circuit device 1 2002
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AMAZON TECHNOLOGIES, INC. (1)
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Endotronix, Inc. (4)
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Vital Sensors Holding Company, Inc. (4)
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SENSIRION AG (2)
8,791,532 Sensor mounted in flip-chip technology on a substrate 0 2009
8,736,002 Sensor mounted in flip-chip technology at a substrate edge 0 2009
 
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TESSERA, INC. (10)
7,566,955 High-frequency chip packages 22 2002
7,298,030 Structure and method of making sealed capped chips 44 2004
7,224,056 Back-face and edge interconnects for lidded package 13 2004
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TESSERA TECHNOLOGIES HUNGARY KFT. (5)
7,265,440 Methods and apparatus for packaging integrated circuit devices 39 2005
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7,495,341 Methods and apparatus for packaging integrated circuit devices 22 2007
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MORGAN RESEARCH CORPORATION (2)
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NETWORK PHOTONICS, INC. (1)
* 2004/0196,608 Method and apparatus for protecting wiring and integrated circuit device 5 2004
 
SENSIC AB (1)
* 2012/0090,381 GAS SENSOR 3 2009
 
QUALCOMM INCORPORATED (2)
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8,148,806 Multiple chips bonded to packaging structure with low noise and multiple selectable functions 11 2008
 
3M INNOVATIVE PROPERTIES COMPANY (3)
6,834,154 Tooling fixture for packaged optical micro-mechanical devices 0 2001
6,798,954 Packaged optical micro-mechanical device 0 2001
6,771,859 Self-aligning optical micro-mechanical device package 4 2001
 
BROOKS INSTRUMENT, LLC (1)
7,941,284 Systems, apparatuses, and methods for measuring a fluid characteristic using a coriolis flow meter 0 2009
 
ALCHIMER (2)
7,247,226 Coating support and method for the selective coating of conductive tracks on one such support 1 2003
* 2006/0103,018 Coating support and method for the selective coating of conductive tracks on one such support 8 2003
 
WAFER-LEVEL PACKAGING PORTFOLIO LLC (2)
* 8,017,435 Method for packaging electronic devices and integrated circuits 1 2007
* 2010/0059,877 Method for packaging electronic devices and integrated circuits 2 2007
 
HONEYWELL INTERNATIONAL INC. (15)
6,914,323 Methods and apparatus for attaching getters to MEMS device housings 7 2003
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6,987,304 Methods and apparatus for particle reduction in MEMS devices 2 2003
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7,635,077 Method of flip chip mounting pressure sensor dies to substrates and pressure sensors formed thereby 10 2005
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7,297,573 Methods and apparatus for particle reduction in MEMS devices 1 2005
7,491,567 MEMS device packaging methods 6 2005
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8,061,212 Method of flip chip mounting pressure sensor dies to substrates and pressure sensors formed thereby 6 2009
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SHINKO ELECTRIC INDUSTRIES CO., LTD. (3)
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ANALOG DEVICES, INC. (1)
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SiTime Corporation (4)
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8,941,247 Stacked die package for MEMS resonator system 0 2014
 
Endress + Hauser Conducta GmbH + Co. KG (1)
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Silicon Microstructures, Inc. (1)
* 2015/0143,926 AREA-EFFICIENT PRESSURE SENSING DEVICE 0 2013
 
FUJIKURA LTD. (2)
* 2012/0039,055 DEVICE MOUNTING STRUCTURE AND DEVICE MOUNTING METHOD 2 2011
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RPX CORPORATION (2)
* 8,026,583 Flip-chip module and method for the production thereof 0 2006
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LIFESHIELD SCIENCES LLC (5)
7,261,733 Endovascular graft with sensors design and attachment methods 22 2002
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7,918,800 Aneurysm sensing devices and delivery systems 1 2004
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ENDO VASCULAR TECHNOLOGIES, INC. (2)
7,399,313 Endovascular graft with separable sensors 20 2003
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MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (2)
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* Cited By Examiner