US Patent No: 6,140,144

Number of patents in Portfolio can not be more than 2000

Method for packaging microsensors

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Abstract

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A method for packaging and protection of sensors, particularly so called microsensors is disclosed. A sensor unit (either a sensor chip or sensor package) is flip chip bonded to a substrate having a through hole, such that the sensing element is placed above the through hole. An underfill material is applied in such a way that due to capillary forces, the entire common area between the sensor and the substrate is completely filled, while the sensing element is not covered by the underfill material. This provides an effective way of sealing the sensing element from the side of the package containing the electronics. For a sensor chip that has been through a first level packaging process, the above mentioned method can still be used for bonding the sensor package to a substrate containing an access hole. For some applications one or multiple layers of protective coatings can be deposited on either one side or both sides of the sensor package for protection against the operating environment. For applications where the sensor is required to operate in a controlled pressure/controlled gas environment, a cavity can be created into the substrate, and the sensor chip can be flip chip bonded (and/or sealed) to the substrate in a controlled environment. An alternative method of packaging is disclosed where the sensor chip is fixed onto the substrate, and a cap is bonded to this substrate using dummy bumps for mechanical strength.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
INTEGRATED SENSING SYSTEMS, INC.YPSILANTI, MI51

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Massoud-Ansari, Sonbol Ann Arbor, MI 12 479
Najafi, Nader Ann Arbor, MI 60 1517

Cited Art Landscape

Patent Info (Count) # Cites Year
 
DELPHI TECHNOLOGIES, INC. (1)
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INVENSYS SYSTEMS, INC. (1)
* 5,285,690 Pressure sensor having a laminated substrate 29 1992
 
FREESCALE SEMICONDUCTOR, INC. (4)
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* 5,600,071 Vertically integrated sensor structure and method 61 1996
* 5,994,161 Temperature coefficient of offset adjusted semiconductor device and method thereof 16 1997
 
Nippondenso Co., Ltd. (1)
* 4,838,089 Semiconductor pressure sensor 37 1987
 
MITSUBISHI DENKI KABUSHIKI KAISHA (1)
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HONEYWELL INC. (1)
* 4,763,098 Flip-chip pressure transducer 33 1985
 
INFINEON TECHNOLOGIES AG (1)
* 5,591,679 Sealed cavity arrangement method 58 1996
* Cited By Examiner

Patent Citation Ranking

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Patent Info (Count) # Cites Year
 
Other [Check patent profile for assignment information] (6)
* 2003/0206,083 Millimeter wave module and radio apparatus 1 2003
* 2004/0051,181 Packaging microelectromechanical structures 0 2003
* 2006/0292,732 Methods of flip-chip image sensor package fabrication 2 2006
* 2008/0237,826 Method for protecting encapsulated sensor structures using stack packaging 3 2007
* 2011/0101,474 METHOD FOR PROTECTING ENCAPSULATED SENSOR STRUCTURES USING STACK PACKAGING 8 2010
9,452,922 Microelectromechanical device with signal routing through a protective cap 0 2013
 
FUENCE CO., LTD. (2)
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SONY CORPORATION (2)
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EPCOS AG (1)
* 8,110,962 MEMS component and method for production 2 2009
 
Lenghways Technology Co., Ltd. (1)
* 6,607,934 Micro-electromechanical process for fabrication of integrated multi-frequency communication passive components 27 2001
 
SAMSUNG ELECTRONICS CO., LTD. (8)
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* 7,263,883 Gyro-sensor comprising a plurality of component units, and fabricating method thereof 8 2005
* 2005/0262,941 Gyro-sensor comprising a plurality of component units, and fabricating method thereof 5 2005
7,468,556 Packaging of hybrid integrated circuits 12 2007
* 2008/0006,939 Packaging of hybrib integrated circuits 3 2007
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TELEDYNE DALSA SEMICONDUCTOR INC. (3)
6,635,509 Wafer-level MEMS packaging 176 2002
6,902,656 Fabrication of microstructures with vacuum-sealed cavity 26 2002
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HITACHI, LTD. (1)
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SKYWORKS SOLUTIONS, INC. (8)
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* 2008/0064,142 Method for fabricating a wafer level package having through wafer vias for external package connectivity 15 2007
8,900,931 In-situ cavity integrated circuit package 0 2007
8,324,728 Wafer level packaging using flip chip mounting 6 2008
* 2010/0244,161 WAFER LEVEL PACKAGING USING FLIP CHIP MOUNTING 5 2008
* 8,809,116 Method for wafer level packaging of electronic devices 1 2012
* 2012/0322,206 METHOD FOR WAFER LEVEL PACKAGING OF ELECTRONIC DEVICES 1 2012
9,153,551 Integrated circuit package including in-situ formed cavity 0 2014
 
HUGHES ELECTRONICS CORPORATION (1)
* 6,573,124 Preparation of passivated chip-on-board electronic devices 4 1999
 
AMKOR TECHNOLOGY, INC. (7)
6,415,505 Micromachine package fabrication method 5 1999
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6,432,737 Method for forming a flip chip pressure sensor die package 37 2001
6,624,921 Micromirror device package fabrication method 27 2001
* 6,455,927 Micromirror device package 62 2001
6,661,080 Structure for backside saw cavity protection 6 2001
6,586,824 Reduced thickness packaged electronic device 16 2001
 
Sandia Corporation (2)
* 6,844,623 Temporary coatings for protection of microelectronic devices during packaging 31 2001
* 8,597,985 MEMS packaging with etching and thinning of lid wafer to form lids and expose device wafer bond pads 1 2012
 
SILEX MICROSYSTEMS AB (4)
* 6,973,835 Pressure sensor 7 2002
* 2004/0237,285 Pressure sensor 2 2004
7,207,227 Pressure sensor 9 2005
* 2006/0032,039 PRESSURE SENSOR 2 2005
 
KABUSHIKI KAISHA TOSHIBA (1)
* 2002/0036,345 High frequency flip chip module and assembling method thereof 31 2001
 
INVENSAS CORPORATION (1)
8,604,605 Microelectronic assembly with multi-layer support structure 1 2007
 
ADVANCED SEMICONDUCTOR ENGINEERING, INC. (2)
7,049,689 Chip on glass package 3 2004
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INTERNATIONAL BUSINESS MACHINES CORPORATION (1)
* 6,599,774 Technique for underfilling stacked chips on a cavity MLC module 6 2001
 
SENSIRION HOLDING AG (4)
* 6,750,522 Sensor accommodated in a housing 7 2002
7,704,774 Pressure sensor having a chamber and a method for fabricating the same 13 2007
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* 2007/0275,495 Method for fabricating a pressure sensor using SOI wafers 7 2007
 
WESTERN DIGITAL TECHNOLOGIES, INC. (2)
8,756,776 Method for manufacturing a disk drive microactuator that includes a piezoelectric element and a peripheral encapsulation layer 33 2009
9,379,311 Apparatus for manufacturing piezoelectric actuators 0 2014
 
SIEMENS AKTIENGESELLSCHAFT (1)
* 2005/0031,490 Module for an analysis device, applicator as an exchange part of the analysis device and analysis device associated therewith 106 2003
 
WESTERN DIGITAL (FREMONT), LLC (1)
8,643,980 Micro-actuator enabling single direction motion of a magnetic disk drive head 112 2008
 
MURATA MANUFACTURING CO., LTD. (1)
* 6,300,676 Small size electronic part and a method for manufacturing the same, and a method for forming a via hole for use in the same 12 1999
 
INFINEON TECHNOLOGIES AG (9)
* 7,445,959 Sensor module and method of manufacturing same 5 2006
* 2008/0128,838 SENSOR MODULE AND METHOD OF MANUFACTURING SAME 3 2006
* 7,994,618 Sensor module and method for manufacturing same 4 2006
* 2007/0126,130 Sensor Module And Method For Manufacturing Same 5 2006
8,674,462 Sensor package 1 2007
* 2009/0026,560 SENSOR PACKAGE 10 2007
9,324,586 Chip-packaging module for a chip and a method for forming a chip-packaging module 0 2011
* 9,366,593 Pressure sensor package with integrated sealing 0 2013
9,379,033 Sensor package 0 2014
 
ATI TECHNOLOGIES INC. (1)
* 6,929,976 Multi-die module and method thereof 6 2003
 
FUJI XEROX CO., LTD. (1)
* 8,166,835 Sensor chip and inspection device 0 2008
 
MICRONIT MICROFLUIDICS B.V. (1)
* 2007/0286,773 Microfluidic Device 13 2007
 
INTEGRATED SENSING SYSTEMS, INC. (1)
8,715,300 Delivery system, method, and anchor for medical implant placement 0 2011
 
ROUND ROCK RESEARCH, LLC (6)
* 7,443,038 Flip-chip image sensor packages 3 2005
* 2005/0230,844 Flip-chip image sensor packages and methods of fabrication 6 2005
7,638,813 Methods of fabrication for flip-chip image sensor packages 21 2006
* 2006/0154,405 Methods of fabrication for flip-chip image sensor packages 5 2006
8,097,895 Electronic device package with an optical device 0 2009
* 2010/0052,086 ELECTRONIC DEVICE PACKAGES AND METHODS OF FABRICATING ELECTRONIC DEVICE PACKAGES 3 2009
 
DENSO CORPORATION (8)
* 6,591,689 Sensor held by base having lead 11 2001
* 2002/0005,072 Sensor held by base having lead 1 2001
* 6,781,208 Functional device, method of manufacturing therefor and driver circuit 7 2002
* 6,787,384 Functional device, method of manufacturing therefor and driver circuit 44 2003
* 7,026,698 Functional device, method of manufacturing therefor and driver circuit 1 2004
* 2004/0209,393 Functional device, method of manufacturing therefor and driver circuit 0 2004
* 8,156,804 Capacitive semiconductor sensor 2 2007
* 2008/0093,740 Capacitive semiconductor sensor 3 2007
 
III HOLDINGS 6, LLC (2)
* 8,153,480 Air cavity package for flip-chip 0 2006
* 2009/0079,050 AIR CAVITY PACKAGE FOR FLIP-CHIP 5 2006
 
ROBERT BOSCH GMBH (10)
* 7,335,971 Method for protecting encapsulated sensor structures using stack packaging 7 2003
* 2004/0197,953 Method for protecting encapsulated sensor structures using stack packaging 4 2003
* 2005/0253,240 Micromechanical component and corresponsing production method 14 2004
* 2005/0194,685 Method for mounting semiconductor chips and corresponding semiconductor chip system 9 2005
* 7,696,001 Method for mounting semiconductor chips on a substrate and corresponding assembly 1 2006
* 2006/0220,258 Method for mounting semiconductor chips on a substrate and corresponding assembly 1 2006
* 7,802,481 High-pressure sensor device and method for manufacturing same 3 2006
* 2006/0278,002 High-pressure sensor device and method for manufacturing same 3 2006
7,859,093 Method for protecting encapsulated sensor structures using stack packaging 0 2007
* 2011/0198,674 GAS-SENSITIVE FIELD EFFECT TRANSISTOR AND METHOD FOR MANUFACTURING A GAS-SENSITIVE FIELD EFFECT TRANSISTOR 1 2011
 
INTEL CORPORATION (6)
* 6,461,891 Method of constructing an electronic assembly having an indium thermal couple and an electronic assembly having an indium thermal couple 6 1999
6,504,242 Electronic assembly having a wetting layer on a thermally conductive heat spreader 39 2001
6,882,043 Electronic assembly having an indium thermal couple 4 2002
* 6,903,452 Packaging microelectromechanical structures 71 2003
* 7,087,451 Microfabricated hot wire vacuum sensor 1 2004
* 2005/0212,066 Microfabricated hot wire vacuum sensor 1 2004
 
ATI TECHNOLOGIES ULC (1)
* 2002/0195,704 Multi-die module and method thereof 1 2001
 
Sanyu Rec Co., Ltd. (1)
* 6,579,748 Fabrication method of an electronic component 33 2000
 
KNOWLES ELECTRONICS, LLC (31)
9,374,643 Embedded dielectric as a barrier in an acoustic device and method of manufacture 0 2011
8,629,551 Bottom port surface mount silicon condenser microphone package 9 2012
8,624,384 Bottom port surface mount silicon condenser microphone package 22 2012
8,704,360 Top port surface mount silicon condenser microphone package 10 2012
8,629,552 Top port multi-part surface mount silicon condenser microphone package 22 2012
8,624,385 Top port surface mount silicon condenser microphone package 23 2012
8,624,386 Bottom port multi-part surface mount silicon condenser microphone package 22 2012
8,624,387 Top port multi-part surface mount silicon condenser microphone package 21 2012
8,765,530 Methods of manufacture of top port surface mount silicon condenser microphone packages 6 2013
8,652,883 Methods of manufacture of bottom port surface mount silicon condenser microphone packages 18 2013
8,633,064 Methods of manufacture of top port multipart surface mount silicon condenser microphone package 20 2013
8,629,005 Methods of manufacture of bottom port surface mount silicon condenser microphone packages 21 2013
8,623,709 Methods of manufacture of top port surface mount silicon condenser microphone packages 21 2013
8,623,710 Methods of manufacture of bottom port multi-part surface mount silicon condenser microphone packages 20 2013
8,617,934 Methods of manufacture of top port multi-part surface mount silicon condenser microphone packages 21 2013
9,078,063 Microphone assembly with barrier to prevent contaminant infiltration 5 2013
9,061,893 Methods of manufacture of top port multi-part surface mount silicon condenser microphones 4 2013
9,156,684 Methods of manufacture of top port surface mount MEMS microphones 0 2014
9,139,421 Top port surface mount MEMS microphone 6 2014
9,051,171 Bottom port surface mount MEMS microphone 6 2014
9,040,360 Methods of manufacture of bottom port multi-part surface mount MEMS microphones 4 2014
9,023,689 Top port multi-part surface mount MEMS microphone 6 2014
9,024,432 Bottom port multi-part surface mount MEMS microphone 6 2014
9,150,409 Methods of manufacture of bottom port surface mount MEMS microphones 4 2014
9,139,422 Bottom port surface mount MEMS microphone 6 2014
9,006,880 Top port multi-part surface mount silicon condenser microphone 6 2014
9,096,423 Methods of manufacture of top port multi-part surface mount MEMS microphones 4 2014
9,133,020 Methods of manufacture of bottom port surface mount MEMS microphones 4 2014
9,148,731 Top port surface mount MEMS microphone 6 2014
9,067,780 Methods of manufacture of top port surface mount MEMS microphones 4 2014
9,338,560 Top port multi-part surface mount silicon condenser microphone 0 2015
 
MITSUBISHI DENKI KABUSHIKI KAISHA (1)
* 6,316,840 Semiconductor device 70 2000
 
Texas Instruments Incorporated (3)
* 2005/0132,803 Low cost integrated MEMS hybrid 3 2004
* 2006/0234,427 Underfill dispense at substrate aperture 2 2005
* 2008/0085,573 UNDERFILL DISPENSE AT SUBSTRATE APERTURE 2 2007
 
GEORGIA TECH RESEARCH CORPORATION (1)
* 6,458,618 Robust substrate-based micromachining techniques and their application to micromachined sensors and actuators 8 2000
 
ENDRESS + HAUSER CONDUCTA GESELLSCHAFT FÜR MESS- UND REGELTECHNIK MBH + CO. KG (1)
* 7,799,606 Semiconductor sensor having a front-side contact zone 0 2003
 
KAVLICO CORPORATION (2)
* 2007/0028,698 LEAD EMBEDDED PRESSURE SENSOR 5 2005
* 7,162,926 Lead embedded pressure sensor 20 2005
 
TRW AUTOMOTIVE U.S. LLC (2)
* 9,175,959 Measuring device mounting method and structure 0 2012
* 2012/0210,787 MEASURING DEVICE MOUNTING METHOD AND STRUCTURE 0 2012
 
FREESCALE SEMICONDUCTOR, INC. (4)
* 6,800,946 Selective underfill for flip chips and flip-chip assemblies 24 2002
* 2004/0118,599 Selective underfill for flip chips and flip-chip assemblies 7 2002
* 8,468,887 Resonant accelerometer with low sensitivity to package stress 0 2008
* 2009/0255,339 RESONANT ACCELEROMETER WITH LOW SENSITIVITY TO PACKAGE STRESS 2 2008
 
RESEARCH TRIANGLE INSTITUTE (3)
6,906,598 Three dimensional multimode and optical coupling devices 4 2002
7,042,306 Three dimensional multimode and optical coupling devices 5 2004
* 2004/0246,065 Three dimensional multimode and optical coupling devices 0 2004
 
Altera Corporation (3)
6,809,384 Method and apparatus for protecting wiring and integrated circuit device 1 2002
* 7,002,215 Floating entrance guard for preventing electrical short circuits 0 2002
6,908,781 Method and apparatus for protecting wiring and integrated circuit device 2 2004
 
AMAZON TECHNOLOGIES, INC. (2)
* 9,131,623 Low-profile circuit board assembly 0 2014
* 2014/0355,234 LOW-PROFILE CIRCUIT BOARD ASSEMBLY 0 2014
 
AMPHENOL THERMOMETRICS, INC. (2)
* 7,053,425 Gas sensor device 16 2003
* 2005/0097,941 Gas sensor device 21 2003
 
ENDOTRONIX, INC. (6)
8,894,582 Cardiac pressure monitoring device 0 2008
* 2009/0054,793 Cardiac pressure monitoring device 10 2008
8,154,389 Wireless sensor reader 1 2009
8,493,187 Wireless sensor reader 2 2010
* 2010/0308,974 WIRELESS SENSOR READER 4 2010
9,305,456 Wireless sensor reader 0 2013
 
VITAL SENSORS HOLDING COMPANY (3)
* 7,686,768 Implantable pressure monitor 3 2006
* 8,376,953 Implantable pressure monitor 0 2011
* 2011/0201,948 IMPLANTABLE PRESSURE MONITOR 1 2011
 
VITAL SENSORS HOLDING COMPANY, INC. (4)
* 7,931,597 Anchored implantable pressure monitor 2 2010
* 7,931,598 Implantable pressure monitor 7 2010
* 2014/0058,276 IMPLANTABLE PRESSURE MONITOR 0 2013
* 2014/0081,158 ANCHORED IMPLANTABLE PRESSURE MONITOR 0 2013
 
SENSIRION AG (2)
8,791,532 Sensor mounted in flip-chip technology on a substrate 0 2009
8,736,002 Sensor mounted in flip-chip technology at a substrate edge 0 2009
 
IP VERWERTUNGS GMBH (1)
* 6,518,084 Method of producing a micromechanical structure for a micro-electromechanical element 14 2001
 
TESSERA, INC. (11)
7,566,955 High-frequency chip packages 24 2002
7,298,030 Structure and method of making sealed capped chips 45 2004
7,224,056 Back-face and edge interconnects for lidded package 17 2004
7,129,576 Structure and method of making capped chips including vertical interconnects having stud bumps engaged to surfaces of said caps 24 2004
* 2005/0082,653 Structure and method of making sealed capped chips 7 2004
* 2005/0085,016 Structure and method of making capped chips using sacrificial layer 25 2004
* 2005/0067,688 Structure and method of making capped chips including vertical interconnects having stud bumps engaged to surfaces of said caps 23 2004
* 2005/0116,344 Microelectronic element having trace formed after bond layer 13 2004
* 2007/0138,644 Structure and method of making capped chip having discrete article assembled into vertical interconnect 24 2005
8,143,095 Sequential fabrication of vertical conductive interconnects in capped chips 3 2005
* 2006/0183,270 Tools and methods for forming conductive bumps on microelectronic elements 4 2006
 
TESSERA TECHNOLOGIES HUNGARY KFT. (5)
7,265,440 Methods and apparatus for packaging integrated circuit devices 42 2005
7,936,062 Wafer level chip packaging 16 2007
7,495,341 Methods and apparatus for packaging integrated circuit devices 25 2007
7,642,629 Methods and apparatus for packaging integrated circuit devices 20 2007
7,479,398 Methods and apparatus for packaging integrated circuit devices 7 2007
 
Morgan Research Corporation (2)
* 7,748,272 MEMS sensor suite on a chip 5 2008
* 2008/0163,687 MEMS Sensor Suite on a Chip 4 2008
 
NETWORK PHOTONICS, INC. (1)
* 2004/0196,608 Method and apparatus for protecting wiring and integrated circuit device 7 2004
 
SENSIC AB (1)
* 2012/0090,381 GAS SENSOR 3 2009
 
QUALCOMM INCORPORATED (2)
* 7,045,901 Chip-on-chip connection with second chip located in rectangular open window hole in printed circuit board 69 2003
8,148,806 Multiple chips bonded to packaging structure with low noise and multiple selectable functions 12 2008
 
3M INNOVATIVE PROPERTIES COMPANY (3)
6,834,154 Tooling fixture for packaged optical micro-mechanical devices 0 2001
6,798,954 Packaged optical micro-mechanical device 0 2001
6,771,859 Self-aligning optical micro-mechanical device package 4 2001
 
BROOKS INSTRUMENT, LLC (1)
7,941,284 Systems, apparatuses, and methods for measuring a fluid characteristic using a coriolis flow meter 0 2009
 
ALCHIMER (2)
7,247,226 Coating support and method for the selective coating of conductive tracks on one such support 1 2003
* 2006/0103,018 Coating support and method for the selective coating of conductive tracks on one such support 9 2003
 
WAFER-LEVEL PACKAGING PORTFOLIO LLC (2)
* 8,017,435 Method for packaging electronic devices and integrated circuits 1 2007
* 2010/0059,877 Method for packaging electronic devices and integrated circuits 3 2007
 
HONEYWELL INTERNATIONAL INC. (16)
6,914,323 Methods and apparatus for attaching getters to MEMS device housings 7 2003
* 2004/0183,177 Methods and apparatus for attaching getters to MEMS device housings 4 2003
6,987,304 Methods and apparatus for particle reduction in MEMS devices 3 2003
* 2004/0222,468 Methods and apparatus for particle reduction in MEMS devices 1 2003
* 2005/0205,951 Flip chip bonded micro-electromechanical system (MEMS) device 49 2004
* 7,077,008 Differential pressure measurement using backside sensing and a single ASIC 19 2004
* 2006/0000,288 Differential pressure measurement using backside sensing and a single ASIC 1 2004
* 2005/0253,283 Getter deposition for vacuum packaging 49 2004
7,635,077 Method of flip chip mounting pressure sensor dies to substrates and pressure sensors formed thereby 10 2005
* 2007/0069,000 Method of flip chip mounting pressure sensor dies to substrates and pressure sensors formed thereby 2 2005
7,297,573 Methods and apparatus for particle reduction in MEMS devices 1 2005
7,491,567 MEMS device packaging methods 9 2005
* 2007/0117,275 MEMS DEVICE PACKAGING METHODS 7 2005
* 2007/0114,643 MEMS FLIP-CHIP PACKAGING 31 2005
8,061,212 Method of flip chip mounting pressure sensor dies to substrates and pressure sensors formed thereby 6 2009
* 2010/0064,818 METHOD OF FLIP CHIP MOUNTING PRESSURE SENSOR DIES TO SUBSTRATES AND PRESSURE SENSORS FORMED THEREBY 14 2009
 
SHINKO ELECTRIC INDUSTRIES CO., LTD. (3)
7,456,497 Electronic devices and its production methods 69 2003
* 2005/0167,795 Electronic devices and its production methods 34 2003
8,216,884 Production methods of electronic devices 0 2008
 
ANALOG DEVICES, INC. (1)
* 2005/0127,525 Semiconductor assembly with conductive rim and method of producing the same 1 2003
 
SITIME CORPORATION (5)
* 8,324,729 Stacked die package for MEMS resonator system 3 2011
* 2011/0227,175 Stacked Die Package for MEMS Resonator System 3 2011
8,669,664 Stacked die package for MEMS resonator system 1 2012
8,941,247 Stacked die package for MEMS resonator system 1 2014
9,371,221 Low-profile stacked-die MEMS resonator system 0 2015
 
ENDRESS+HAUSER CONDUCTA GMBH+CO. KG (1)
* 2006/0159,590 Semiconductor sensor having a front-side contact zone 2 2003
 
SILICON MICROSTRUCTURES, INC. (1)
* 2015/0143,926 AREA-EFFICIENT PRESSURE SENSING DEVICE 0 2013
 
FUJIKURA LTD. (2)
* 2012/0039,055 DEVICE MOUNTING STRUCTURE AND DEVICE MOUNTING METHOD 2 2011
* 2012/0261,177 DEVICE PACKAGING STRUCTURE AND DEVICE PACKAGING METHOD 3 2012
 
RPX CORPORATION (2)
* 8,026,583 Flip-chip module and method for the production thereof 0 2006
* 2011/0001,232 Flip-Chip Module and Method for the Production Thereof 0 2006
 
LIFESHIELD SCIENCES LLC (5)
7,261,733 Endovascular graft with sensors design and attachment methods 25 2002
* 2003/0229,388 Endovascular graft with pressure, temperature, flow and voltage sensors 1 2002
7,918,800 Aneurysm sensing devices and delivery systems 2 2004
* 2006/0200,220 Endovascular graft with sensors design and attachment methods 12 2006
* 2011/0213,413 ANEURYSM SENSING DEVICES AND DELIVERY SYSTEMS 3 2011
 
ENDO VASCULAR TECHNOLOGIES, INC. (2)
7,399,313 Endovascular graft with separable sensors 22 2003
* 2004/0199,238 Endovascular graft wih separable sensors 0 2003
 
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (2)
* 6,549,105 Millimeter wave module and radio apparatus 0 2001
6,778,041 Millimeter wave module and radio apparatus 3 2003
* Cited By Examiner