US Patent No: 6,140,144

Number of patents in Portfolio can not be more than 2000

Method for packaging microsensors

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Abstract

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A method for packaging and protection of sensors, particularly so called microsensors is disclosed. A sensor unit (either a sensor chip or sensor package) is flip chip bonded to a substrate having a through hole, such that the sensing element is placed above the through hole. An underfill material is applied in such a way that due to capillary forces, the entire common area between the sensor and the substrate is completely filled, while the sensing element is not covered by the underfill material. This provides an effective way of sealing the sensing element from the side of the package containing the electronics. For a sensor chip that has been through a first level packaging process, the above mentioned method can still be used for bonding the sensor package to a substrate containing an access hole. For some applications one or multiple layers of protective coatings can be deposited on either one side or both sides of the sensor package for protection against the operating environment. For applications where the sensor is required to operate in a controlled pressure/controlled gas environment, a cavity can be created into the substrate, and the sensor chip can be flip chip bonded (and/or sealed) to the substrate in a controlled environment. An alternative method of packaging is disclosed where the sensor chip is fixed onto the substrate, and a cap is bonded to this substrate using dummy bumps for mechanical strength.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
INTEGRATED SENSING SYSTEMS, INC.YPSILANTI, MI49

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Massoud-Ansari, Sonbol Ann Arbor, MI 15 322
Najafi, Nader Ann Arbor, MI 90 845

Cited Art Landscape

Patent Info (Count) # Cites Year
 
FREESCALE SEMICONDUCTOR, INC. (4)
5,646,072 Electronic sensor assembly having metal interconnections isolated from adverse media 16 1995
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DELPHI TECHNOLOGIES, INC. (1)
5,209,122 Pressurer sensor and method for assembly of same 21 1991
 
Honeywell Inc. (1)
4,763,098 Flip-chip pressure transducer 31 1985
 
INFINEON TECHNOLOGIES AG (1)
5,591,679 Sealed cavity arrangement method 53 1996
 
INVENSYS SYSTEMS, INC. (1)
5,285,690 Pressure sensor having a laminated substrate 24 1992
 
MITSUBISHI DENKI KABUSHIKI KAISHA (1)
5,721,446 Semiconductor pressure sensor with spacing member disposed between sensor and substrate 11 1997
 
Nippondenso Co., Ltd. (1)
4,838,089 Semiconductor pressure sensor 33 1987

Patent Citation Ranking

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Patent Info (Count) # Cites Year
 
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MEGIT ACQUISITION CORP. (2)
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Other [Check patent profile for assignment information] (1)
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