Heat sink conduction between disk drive carrier and information storage enclosure

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 6141211
SERIAL NO

09107095

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A mass storage system includes data storage modules having fins extending therefrom and further includes an enclosure having guides for slidably receiving the fins of the data storage modules into the enclosure and for enabling a coupled position of the data storage modules within the enclosure. A generally contacting fit is formed between the fins and guides for conducting heat from the data storage modules to the enclosure when the modules are disposed in the coupled position within the enclosure. In a preferred embodiment, the data storage modules include high performance disk drives disposed within carrier housings. The guides act as rail guides for slidably receiving the modules into the enclosure and for enabling electrical connection between the disk drives and the enclosure in the coupled position. The guides and firs are formed to maximize surface area contact therebetween when the drives are in the coupled position. In an alternate embodiment, the data storage modules are positionally biased within the enclosure when in the coupled position for improved surface area contact between the modules and the enclosure.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG ELECTRONICS CO LTD129 SAMSUNG-RO YEONGTONG-GU SUWON-SI GYEONGGI-DO 16677 16677

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hite, Gregory H Meridian, ID 2 57
Strickler, Mike T Meridian, ID 7 159

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