Modular power electronics die having integrated cooling apparatus
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Oct 31, 2000
Grant Date -
N/A
app pub date -
Dec 23, 1998
filing date -
Dec 23, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A power electronics device incorporating a modular packaging concept and having an integrated device cooler is disclosed. A modular power electronics die cooler is designed for use with a coolant manifold adapted to circulate a coolant medium past a mounting receptacle. The modular power electronics die cooler comprises a base unit adapted for mounting to the manifold, with the base unit having an upper portion and a lower portion. The upper portion includes a plurality of sidewalls defining an enclosure, and the lower portion includes a heat sink and is adapted for insertion in the manifold receptacle. At least one electronic component is mounted within the enclosure. Accordingly, upon mounting the base unit to the manifold, the heat sink is positioned in the coolant medium and thereby dissipates heat produced by the electronic component.
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