Wafer-to-wafer transfer of microstructures using break-away tethers
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United States of America Patent
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-
Nov 7, 2000
Issued Date -
N/A
app pub date -
May 31, 1997
filing date -
May 31, 1997
priority date (Note) -
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status (Latency Note)
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Abstract
Break-away tethers to secure electronic, mechanical, optical, or other microstructures, during release from one substrate and transfer to another. Microstructures are fabricated with integrated tethers attaching them to a first substrate. The structures are undercut by etching and contacted and bonded to a second substrate. First and second substrates are separated, breaking the tethers.
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