Method of cleaning semiconductor wafers and other substrates
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Nov 7, 2000
Issued Date -
N/A
app pub date -
Jul 29, 1998
filing date -
Jul 15, 1996
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method and apparatus for cleaning a wafer oriented vertically is provided. The apparatus includes a first brush and a second brush located horizontally from the first brush. During use, a wafer is orientated vertically between the first and second brushes. The brushes are brought into contact with the wafer and rotated thereby engaging the wafer with rollers. By rotating the rollers, the wafer is also rotated. Liquid is sprayed towards the brushes and wafer. By orienting the wafer vertically, liquid and particulates contained therein readily fall from the wafer due to gravity. This is particularly advantageous when cleaning larger diameter wafers in which particulates must be removed from a larger wafer surface area.
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